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Systems and methods for bonding surfaces using releasable adhesives

A kind of adhesive system and adhesive technology, applied in the direction of adhesive method, adhesive type, ester copolymer adhesive, etc., can solve the problem of connection loss and so on

Active Publication Date: 2019-04-09
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, the presence of air pockets at or within the bonding surface can lead to potential connection loss

Method used

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  • Systems and methods for bonding surfaces using releasable adhesives
  • Systems and methods for bonding surfaces using releasable adhesives
  • Systems and methods for bonding surfaces using releasable adhesives

Examples

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Embodiment Construction

[0025] Specific embodiments of the present disclosure are disclosed herein as needed. The specific embodiments disclosed are merely examples, which can be implemented in different and alternative ways and combinations thereof. As used herein, for example, "exemplary" and similar terms refer broadly to an embodiment that is an illustration, sample, model, or drawing.

[0026] Although the technology is primarily described herein in relation to automobiles, the technology is not limited to automobiles. The concept can be used in a wide variety of vehicular applications, such as in connection with aircraft, watercraft and other vehicles and consumer electronics components. Additionally, the concept can be used in a variety of consumer applications such as electronic components, apparel design (e.g., fasteners and closures), garment clipping (e.g., work gloves, sports gloves), and signage (e.g., Permanent signage for businesses and temporary signage for traffic detours), etc. F...

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Abstract

The present invention relates to systems and methods for bonding surfaces using releasable adhesives. A releasable adhesive system is used to bond the first surface to the second surface. The system includes: a primary material having a first portion comprising at least one molecule of a first portion configured to be positioned parallel to at least one first surface molecule of the first surface and a second portion opposite the first portion, The two moieties include at least one second moiety molecule configured to be positioned parallel to the at least one second surface molecule of the second surface. The first portion of molecules positioned parallel to the first surface molecules is configured to maintain the bond between the first portion and the first surface until one or more predetermined force conditions (e.g., predetermined shear, pull, and peel forces) are applied on the first surface. The second portion can function similarly with respect to the second surface. Also provided are methods of bonding a first surface to a second surface utilizing such releasable adhesives.

Description

[0001] claim priority statement [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 079,326, filed November 13, 2014. technical field [0003] The present disclosure generally relates to systems and methods for temporarily or permanently joining two surfaces. More specifically, the present disclosure relates to systems and methods for temporarily or permanently bonding two surfaces using a releasable adhesive. Background technique [0004] Joining surfaces of similar or dissimilar materials often requires extensive workmanship, such as applying permanent adhesives and welding. However, access to these surfaces after bonding (eg, by fitters or machines) can be difficult due to the permanent nature of the adhesive and weld. Restricted access to these surfaces can make repairs more difficult. [0005] Permanent joining processes (eg, ultrasonic welding) can require significant equipment and tooling capital expenditures. Additionally, when equ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J169/00C09J123/06C09J123/12C09J177/00C09J133/04C09J155/02C09J167/02C09J11/04C09J11/00C09J7/30C09J5/00C09J9/00
CPCC08K3/04C08K3/08C08K3/34C08K7/24C08K2003/0806C08K2003/0831C08K2003/085C08K2201/011C09J5/00C09J9/00C09J11/00C09J11/04C09J11/08C09J123/06C09J123/12C09J133/04C09J155/02C09J167/02C09J169/00C09J177/00C09J183/04C09J7/20B32B5/024B32B5/22B32B5/26B32B7/06B32B7/12B32B25/02B32B25/10B32B25/20B32B2262/0261B32B2262/0269B32B2262/101B32B2262/106B32B2264/105B32B2307/50B32B2307/51B32B2307/546B32B2307/748B32B2405/00C09J2483/006C09J2301/31B32B3/266
Inventor R·郭J·P·斯皮塞Y·林R·C·塞科尔J·A·阿贝尔M·A·史密斯
Owner GM GLOBAL TECH OPERATIONS LLC
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