Backlight fpc full-page adhesive film and its overall adhesive process
A backlight and full-page technology, applied in the structural connection of printed circuits, printed circuit components, printed circuits, etc., can solve the problems of low production efficiency and high product defect rate, and achieve the goal of improving production efficiency and improving product yield. Effect
Active Publication Date: 2018-10-02
SHENZHEN HUICHEN ELECTRONICS
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- Description
- Claims
- Application Information
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Problems solved by technology
In the prior art, when pasting the adhesive film on the FPC lamp board, each FPC needs to be carried out one by one, the production efficiency is low and the product defective rate is high
Method used
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
[0028] In addition, the ...
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The invention discloses a backlight FPC (Flexible Printed Circuit board) full page adhesive film and an overall rubberizing process thereof. The backlight FPC full page adhesive film is matched with a full page FPC lamp panel; a plurality of FPC substrates are arranged in rows on the full page FPC lamp panel; the backlight FPC full page adhesive film comprises a carrier and a plurality of FPC adhesive films which are arranged in rows on the carrier; the plurality of FPC adhesive films are arranged corresponding to the plurality of FPC substrates on the full page FPC lamp panel one by one; and the backlight FPC full page adhesive film and the full page FPC lamp panel are provided with a plurality of positioning holes which are matched in an alignment way respectively. According to the backlight FPC overall rubberizing process, the full page adhesive film is laminated with the full page FPC lamp panel at one time. According to the technical scheme, the FPC adhesive films are attached to the plurality of FPC substrates on the full page FPC panel at one time, and full page lamination is performed instead of one-by-one lamination, so that the production efficiency is increased, and the product yield can be increased.
Description
technical field [0001] The invention relates to the technical field of FPC (Flexible Printed Circuit board, flexible printed circuit board) production, in particular to a backlight FPC full-plate adhesive film and an integral adhesive process thereof. Background technique [0002] The backlight FPC needs to be glued on the FPC light board to protect the FPC circuit structure during production. The backlight FPC is provided with multiple light sources in rows. The multiple light sources protrude higher. Avoid these light sources, so the FPC film will set a through inner frame in the middle. In the prior art, when pasting the film on the FPC light board, each FPC needs to be carried out one by one, and the production efficiency is low and the defective rate of the product is high. Contents of the invention [0003] The main purpose of the present invention is to provide a backlight FPC full-plate adhesive film and its overall adhesive process, aiming at improving the effici...
Claims
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IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/14H05K3/365H05K2201/058
Inventor 肖政鹏吴亚飞
Owner SHENZHEN HUICHEN ELECTRONICS