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An intelligent industrial dispensing control method

A control method and dispensing technology, which is applied in the direction of material bonding, semiconductor/solid-state device manufacturing, connecting components, etc.

Active Publication Date: 2019-06-21
新沂市承翔电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be said that as long as glue is used, the glue dispensing process needs to be realized. However, in industrial production, especially in the assembly of circuit boards, the automatic dispensing process still needs continuous improvement

Method used

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  • An intelligent industrial dispensing control method
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Embodiment Construction

[0018] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. The following embodiments can be used in combination, and the present invention can be implemented in various forms, and is not limited to each specific embodiment described in this specification. These embodiments are provided. The purpose of the examples is to make the disclosure of the present invention more thorough and comprehensive to facilitate understanding. It should be further noted that when a certain structure is fixed to another structure, it includes directly or indirectly fixing the structure to the other structure, or fixing the structure to the other structure through one or more other intermediate structures. When a structure is connected to another structure, it includes directly or indirectly connecting the structure to the other structure, or connecting the structure to the other structure through one or more other intermedi...

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Abstract

The invention provides an intelligent industrial dispensing control method. The intelligent industrial dispensing control method comprises the following steps: automatic plate feeding, automatic dispensing, automatic adhering, and automatic plate discharging. The step of automatic dispensing comprises the following substeps: dispensing, detecting and solidifying, and the detecting is automatic detecting. A step of automatic marking is further carried out between the step of automatic plate feeding and the step of automatic dispensing. By the scheme, the steps of plate feeding, dispensing, adhering and plate discharging are carried out automatically, and automatic dispensing operation of industrial production is realized. The intelligent industrial dispensing control method is suitable for automatic dispensing production of chips, circuit boards, mobile phones and the like, and is particularly suitable for full-automatic dispensing technologies of fingerprint identification modules, and dispensing operation can be automatically finished in a one-stop manner.

Description

technical field [0001] The invention relates to a glue dispensing process, in particular to an intelligent industrial glue dispensing control method. Background technique [0002] Glue dispensing is a process, also known as sizing, gluing, glue pouring, glue dropping, etc. It is to smear, fill, and drop electronic glue, oil or other liquids on the product, so that the product can stick and fill. Sealing, insulation, fixing, smooth surface, etc. [0003] The application range of dispensing is very wide, ranging from large aircraft and ships to small production of clothes and toys, all of which may require dispensing. It can be said that as long as glue is used, the glue dispensing process needs to be realized. However, in industrial production, especially in the assembly of circuit boards, the automatic dispensing process still needs continuous improvement. [0004] Therefore, how to design the dispensing method so that the industrialized production can be carried out autom...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56F16B11/00B05D1/26
CPCB05D1/26F16B11/006
Inventor 何定
Owner 新沂市承翔电子有限公司