Efficient heat-dissipation type bus duct

A bus duct and heat dissipation technology, which is applied in the field of high-efficiency heat dissipation bus duct, can solve the problems of unsatisfactory heat dissipation effect, small heat dissipation area, and high heat dissipation requirements of the bus duct, and achieve simple structure, normal use and increased service life. Effect

Inactive Publication Date: 2016-09-28
江苏万威电气有限公司
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AI Technical Summary

Problems solved by technology

The traditional busway includes a shell, which is composed of a cover plate and a side plate. With the continuous improvement of the current capacity, the busway uses air conduction to dissipate heat, and dissipates the heat through the steel or aluminum shell in close contact, but Under this heat dissipation method, the heat dissipation area is small, and the heat dissipation effect of the bus duct is not ideal. In order to ensure the long-term normal use of the bus duct, the heat dissipation requirements for it are getting higher and higher

Method used

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  • Efficient heat-dissipation type bus duct

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] see figure 1 , the present invention provides a technical solution:

[0015] A high-efficiency heat dissipation busway, including a busway housing 1, the busway housing 1 is a hollow structure, the busway housing 1 includes an upper top plate 2, a support frame 3 and a lower bottom plate 4, and the two ends of the support frame 3 are respectively The bottom surface of the upper top plate 2 and the top surface of the lower bottom plate 4 a...

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Abstract

The invention relates to the field of bus ducts, in particular an efficient heat-dissipation type bus duct. The bus duct comprises a bus duct shell which is a hollow structure, the bus duct shell comprises a top plate, a support frame and a bottom plate, multi-group of electric conductors are arranged in a placing cavity of the support frame, and a plastic insulating layer is filled in the placing cavity; a side plate at each of two sides of the support frame is provided with a heat conducting layer, the outside of the heat conducting layer is provided with a heat-dissipation net layer, heat-dissipation curved sheets and heat-dissipation ribs are respectively arranged between the heat-dissipation net layer and the heat conducting layer, the heat-dissipation curved sheets are arranged in waveform, and the heat-dissipation curved sheets and the heat-dissipation ribs are respectively fixed and connected with the heat-dissipation net layer; the bottom surface of the bottom plate is provided with a rubber cushion. The bus duct disclosed by the invention is simple in structure and low in cost, the structure of multi-layer of heat-dissipation and cooling is adopted so that the heat is fast volatilized, the aim of heat-dissipating, cooling and damping through the bus duct shell is achieved, the normal use of the bus duct is guaranteed, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of bus ducts, in particular to a high-efficiency heat dissipation bus duct. Background technique [0002] As a new type of distribution wire, bus duct has become more and more popular. It has the advantages of long service life, high safety performance, convenient power feeding, easy installation, and small installation space. The traditional busway includes a shell, which is composed of a cover plate and a side plate. With the continuous improvement of the current capacity, the busway uses air conduction to dissipate heat, and dissipates the heat through the steel or aluminum shell in close contact, but Under this heat dissipation method, the heat dissipation area is small, and the heat dissipation effect of the bus duct is not ideal. In order to ensure the long-term normal use of the bus duct, the heat dissipation requirements for it are getting higher and higher. Contents of the invention [0003] The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G5/06H02G5/10
CPCH02G5/06H02G5/10
Inventor 陈锦荣王成贵曹正远
Owner 江苏万威电气有限公司
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