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Capacitive sensing assembly including a thin film plastic

A technology of capacitive sensing and capacitive sensor, which is applied in household components, computer parts, electrical digital data processing, etc.

Active Publication Date: 2016-10-05
SYNAPTICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of this, placing sensors within electronic devices has been challenging given the limited amount of space for additional components

Method used

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  • Capacitive sensing assembly including a thin film plastic
  • Capacitive sensing assembly including a thin film plastic
  • Capacitive sensing assembly including a thin film plastic

Examples

Experimental program
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Embodiment Construction

[0019] Electronic devices such as mobile phones, tablet devices, and laptop computers often use different forms of ultra-high gloss substrates as covers for the devices. These substrates are often made of materials such as glass, clear or colored plastic, acrylic or any other material with a high gloss surface.

[0020] To fit a biosensor, such as a fingerprint sensor, into the housing of an electronic device, an ultra-high gloss surface can be used on the upper portion of the biosensor so as to match the surrounding surface of the electronic device in which the biosensor is contained. Some embodiments of the present disclosure use IMD (In-Mold Decoration) manufacturing techniques to provide a top cover over the fingerprint sensor. IMD manufacturing is a process technology by which thin-film plastic layers are created that are not normally possible using conventional injection molding. For a fingerprint sensor to function, the material used on the conductive parts of the sens...

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Abstract

A capacitive sensing stackup is disclosed that includes: a thin film plastic; an injection molded plastic component bonded to the thin film plastic, wherein the injection molded plastic component forms a cavity bounded by the injection molded plastic and the thin film plastic that exposes at least a portion of the thin film plastic; and a capacitive sensor assembly including a plurality of sensor electrodes configured to be driven with a capacitive sensing signal, wherein the capacitive sensor assembly is coupled to the thin film plastic in the cavity formed by the injection molded plastic component.

Description

technical field [0001] The present disclosure relates generally to the field of capacitive sensing, and more particularly, to capacitive sensing assemblies including thin film plastics. Background technique [0002] Capacitive sensing technology has been instrumental in biometric identification and authorization processes since its inception. In many cases, a single biomarker can be used to uniquely identify an individual in a manner that cannot be easily replicated or imitated. The ability to capture and store biological data in the smallest digital files has yielded enormous benefits in areas such as law enforcement, forensics, and information security. [0003] However, there are many obstacles to the widespread adoption of capacitive sensing technology in a wide range of applications. One of these hurdles is the need for a separate and unique device, commonly referred to as a sensor, for capturing biological data. As handheld devices begin to assume a greater range of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306B29L2031/3481B29C45/14688B29C45/14G06F2203/04103G06F3/044B29L2031/3475
Inventor V.穆亚P.博克马
Owner SYNAPTICS INC