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37results about How to "Reduce electrical influence" patented technology

Method for manufacturing solar thin film light transmitting component

The invention relates to a method for manufacturing a solar thin film light transmitting component, belonging to the technical field of photovoltaic application. The manufacturing method adopts the following technical scheme: a front transparent electric conductive electrode, a thin film photoelectric conversion layer and a back electric conductive electrode are deposited on an insulating light transmitting substrate, and a plurality of son batteries are formed by cutting off the three thin films; then mechanical inscribing equipment is used for removing the front transparent electric conductive electrode, the thin film photoelectric conversion layer and the back electric conductive electrode (or the thin film photoelectric conversion layer and the back electric conductive electrode) in a direction parallel to or vertical to the son batteries, a pattern is inscribed by adjusting a needle head the equipment; as the photoelectric conversion layer in the patter is removed, therefore, lights can directly penetrate through the battery, thereby realizing the light transmitting function of the component. The manufacturing method can be used for realizing the preparation of the novel light transmitting component and has the characteristics of low cost, high efficiency, simple operation, short time consumption and the like while the output electrical property and the light transmission performance of the novel light transmitting component are not lower than that of the light transmitting component of the solar thin film battery prepared by the prior art.
Owner:BAODING TIANWEI GRP CO LTD

Regulating method for distributed MEMS phase shifter working voltage based on phase shift magnitude electromechanical coupling

The invention discloses a regulating method for distributed MEMS phase shifter working voltage based on phase shift magnitude electromechanical coupling. The regulating method comprises the steps that structural parameters, material properties and electromagnetic working parameters of distributed MEMS phase shifters are determined; a working voltage standard value V<0> and a phase shift magnitude standard value deltaphi<0> are determined; working voltage of 2V<0> is applied, and phase shift magnitude deltaphi in M MEMS bridges is measured; the phase shift magnitude measured value deltaphi and the standard value deltaphi<0> are compared; when the phase shift magnitude measured value deltaphi is greater than the standard value deltaphi<0>, upward height error of the MEMS bridges is obtained, and equivalent circuit parameters and working voltage regulating amount are calculated; when the phase shift magnitude measured value deltaphi is less than or equal to the standard value deltaphi<0>, downward height error or the state of error free of the MEMS bridges is obtained, the equivalent circuit parameters and a height error value are calculated, and the working voltage regulating amount is calculated; whether all the working voltage regulating amount is calculated is judged; the working voltage regulating amount is applied to the corresponding MEMS bridges again, and the overall phase shift magnitude of the distributed MEMS phase shifters is measured; and whether electrical performance of the distributed MEMS phase shifters after working voltage regulation can meet the indicator requirements is judged. Theoretical guidance is provided for reliability of practical work.
Owner:XIDIAN UNIV

Minimized high-isolation ceramic packaging structure

The invention discloses a minimized high-isolation ceramic packaging structure including a pipe case (a), a chip (b), a metal cover plate (c) and a bonding wire (d); the pipe case (a) is composed of a ceramic layer (a1), a metallization layer (a2) and an interconnection blind hole (a3); the metallization layer (a2) is composed of a bonding finger layer (a21), a sealing area (a22), a connection area (a23), a bonding chip area (a24) and a printed circuit board trace layer (a25); the pipe case(a) is provided in the center thereof with the bonding chip area (a24) for displacing the chip, and the circumference of the bonding chip area (a24) is provided with the bonding finger layer (a21) which includes a grounding bonding finger (a211) and a signal bonding finger (a212). The structure herein has the beneficial effects that stratum isolation technology is adopted, and space stereo-wrapping is conducted on the high-isolation bonding finger, and a space "sandwich" structure is formed; the structure can markedly reduce cross talk and coupling effect of the signal channels, reduce signal loss, increase isolation level, and reduce impact of packaging on the electrical property of the products, provided that the high reliability of the packaging is guaranteed by the structure.
Owner:CHENGDU CORPRO TECH CO LTD

Brassylic acid glycidyl ester modified hexamethylenediamine curing agent and preparation method and applications thereof

The invention discloses a brassylic acid glycidyl ester modified hexamethylenediamine curing agent and a preparation method and applications thereof. The preparation method comprises the following steps: at first, carrying out esterification reactions between brassylic acid and epoxy chloropropane under the effect of a catalyst in a toluene solvent at a controlled temperature of 80-110 DEG C to obtain a chloro-alcohol ester intermediate; mixing the chloro-alcohol ester intermediate with a sodium hydroxide water solution, carrying out cyclization reactions at a controlled temperature of 40-85 DEG C to obtain brassylic acid glycidyl ester; and finally, carrying out amination reactions between brassylic acid glycidyl ester and hexamethylenediamine at a temperature of 60 to 75 DEG C to obtain the brassylic acid glycidyl ester modified hexamethylenediamine curing agent. The prepared brassylic acid glycidyl ester modified hexamethylenediamine curing agent has a high amine value, can be used with epoxy resin (epoxy resin E51, for example) to carry out curing, and has an excellent toughening effect on a cured product. The preparation method has the advantages of simple production technology, convenient operation, high output, and suitability for industrial production.
Owner:SHANGHAI RESIN FACTORY

Dimeric fatty acid-diglycidol ester modified amine hardener, preparation method and application

The invention discloses a dimeric fatty acid-diglycidol ester modified amine hardener, a preparation method and an application. The preparation method comprises the steps: firstly, subjecting dimericfatty acid and epichlorohydrin to an esterification reaction for 1.5 to 3.0 hours in the presence of a catalyst while controlling a temperature to 80 DEG C to 110 DEG C, so as to obtain a chlorohydrinester intermediate; then, subjecting the chlorohydrin ester intermediate and a sodium hydroxide aqueous solution with the mass percent concentration of 20% to 50% for 2 to 5 hours at the temperatureof 40 DEG C to 85 DEG C, so as to obtain a dimeric fatty acid-diglycidol ester; and finally, subjecting the dimeric fatty acid-diglycidol ester and diethylenetriamine to an amination reaction for 1 to4 hours at the temperature of 60 DEG C to 75 DEG C, thereby obtaining the dimeric fatty acid-diglycidol ester modified amine hardener. The obtained dimeric fatty acid-diglycidol ester modified aminehardener has a relatively high amine number and has excellent toughening performance to the hardening of epoxy resin. The preparation process is simple, and the operation is convenient, so that the preparation method is applicable to large-scale industrial production.
Owner:SHANGHAI INST OF TECH

Resistive non-volatile memory device

ActiveCN104078562AReduce the electrical influence of componentsReduce the variation of resistance conversion resistanceElectrical apparatusDigital storageEngineeringMetal-insulator-metal
The invention provides a resistive non-volatile memory device, which comprises a bottom electrode contact plug, a bottom electrode, a resistive switching layer, a top electrode, anda top electrode contact plug, wherein the bottom electrode is arranged on the bottom electrode plug and is in contact with the bottom electrode plug; the resistive switching layer is arranged on the bottom electrode; the top electrode is arranged on the resistive switching layer; the top electrode contact plug is arranged on the top electrode and is in contact with the top electrode; and the bottom electrode contact plug and the top electrode contact plug are mutually separated by a certain distance in a top view direction. The invention provides the resistive non-volatile memory device with the advantages that through the arrangement of the electrode contact plugs, the top electrode contact plug can be far away from a partial MIM (Metal-Insulator-Metal) overlapped layer positioned right above the bottom electrode contact plug, so that the influence on the electrical property of elements due to the top surface profile of the bottom electrode contact plug is reduced; and thus, the resistive switching resistance variation amount of the elements can be reduced.
Owner:WINBOND ELECTRONICS CORP

Piezoelectric module and electronic device

The invention relates to a piezoelectric module and an electronic device. A piezoelectric module includes a substrate having a working surface; a piezoelectric unit, arranged on the working surface ofthe substrate, the piezoelectric unit being provided with a first side and a second side which are oppositely arranged in the direction parallel to the working surface, and the first side and the second side being each provided with a side electrode; a first extension electrode, arranged on one side, far away from the substrate, of the piezoelectric unit; a conductive bonding structure, arrangedbetween the substrate and the piezoelectric unit, or arranged on the substrate and positioned on the side edge of the electrode on the corresponding side of the piezoelectric unit, so that the piezoelectric unit is electrically connected with the substrate; a first insulation protection layer, arranged on the surface, far away from the substrate, of the piezoelectric unit and covering the first extension electrode; and a second insulating protection layer covering the side electrodes on the surfaces of the first side and the second side of the piezoelectric unit and extending to the working surface of the substrate from the first side and the second side, so that the conductive bonding structure is isolated from the outside.
Owner:NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH

Laser marking method of silicon wafer and manufacturing method of heterojunction cell

The invention discloses a laser marking method of a silicon wafer and a manufacturing method of a heterojunction cell. The laser marking method comprises the steps: enabling a pattern of a marking line to generate a marking code through setting marking parameters; inputting the marking code to a laser; and the laser being used to emit light beams to the surface of the silicon wafer according to the marking code, and the light beams being used to etch the surface of the silicon wafer to obtain the marking line. The marking line comprises a scribing line formed on the surface of the silicon wafer, and the scribing line comprises a solid line segment formed after the surface of the silicon wafer is etched by the laser and a dotted line segment which is not etched by the laser. According to the laser marking method, the mechanical damage to the silicon wafer in the laser marking process can be reduced to the greatest extent, the damaged surface formed on the silicon wafer is relatively smooth, and the silicon wafer does not have a shadow under PL imaging; and after the heterojunction cell is prepared, the electric leakage phenomenon at the laser code printing position is less, the electrical property is better, and the cell conversion efficiency is high. In addition, after the silicon wafer is textured and cleaned, a pyramid textured surface can be formed at the etching position, so that the influence of the silicon wafer on light absorption is avoided.
Owner:宣城睿晖宣晟企业管理中心合伙企业(有限合伙)

A miniaturized high-isolation ceramic packaging structure

The invention discloses a minimized high-isolation ceramic packaging structure including a pipe case (a), a chip (b), a metal cover plate (c) and a bonding wire (d); the pipe case (a) is composed of a ceramic layer (a1), a metallization layer (a2) and an interconnection blind hole (a3); the metallization layer (a2) is composed of a bonding finger layer (a21), a sealing area (a22), a connection area (a23), a bonding chip area (a24) and a printed circuit board trace layer (a25); the pipe case(a) is provided in the center thereof with the bonding chip area (a24) for displacing the chip, and the circumference of the bonding chip area (a24) is provided with the bonding finger layer (a21) which includes a grounding bonding finger (a211) and a signal bonding finger (a212). The structure herein has the beneficial effects that stratum isolation technology is adopted, and space stereo-wrapping is conducted on the high-isolation bonding finger, and a space "sandwich" structure is formed; the structure can markedly reduce cross talk and coupling effect of the signal channels, reduce signal loss, increase isolation level, and reduce impact of packaging on the electrical property of the products, provided that the high reliability of the packaging is guaranteed by the structure.
Owner:CHENGDU CORPRO TECH CO LTD

A kind of tridecanedioic acid glycidyl ester modified amine curing agent and its preparation method and application

The invention discloses a brassylic acid glycidyl ester modified hexamethylenediamine curing agent and a preparation method and applications thereof. The preparation method comprises the following steps: at first, carrying out esterification reactions between brassylic acid and epoxy chloropropane under the effect of a catalyst in a toluene solvent at a controlled temperature of 80-110 DEG C to obtain a chloro-alcohol ester intermediate; mixing the chloro-alcohol ester intermediate with a sodium hydroxide water solution, carrying out cyclization reactions at a controlled temperature of 40-85 DEG C to obtain brassylic acid glycidyl ester; and finally, carrying out amination reactions between brassylic acid glycidyl ester and hexamethylenediamine at a temperature of 60 to 75 DEG C to obtain the brassylic acid glycidyl ester modified hexamethylenediamine curing agent. The prepared brassylic acid glycidyl ester modified hexamethylenediamine curing agent has a high amine value, can be used with epoxy resin (epoxy resin E51, for example) to carry out curing, and has an excellent toughening effect on a cured product. The preparation method has the advantages of simple production technology, convenient operation, high output, and suitability for industrial production.
Owner:SHANGHAI RESIN FACTORY
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