The invention discloses a
laser marking method of a
silicon wafer and a manufacturing method of a
heterojunction cell. The
laser marking method comprises the steps: enabling a pattern of a marking line to generate a marking code through setting marking parameters; inputting the marking code to a
laser; and the laser being used to emit light beams to the surface of the
silicon wafer according to the marking code, and the light beams being used to etch the surface of the
silicon wafer to obtain the marking line. The marking line comprises a scribing line formed on the surface of the silicon wafer, and the scribing line comprises a
solid line segment formed after the surface of the silicon wafer is etched by the laser and a dotted
line segment which is not etched by the laser. According to the laser marking method, the mechanical damage to the silicon wafer in the laser marking process can be reduced to the greatest extent, the damaged surface formed on the silicon wafer is relatively smooth, and the silicon wafer does not have a shadow under PL imaging; and after the
heterojunction cell is prepared, the electric leakage phenomenon at the laser code printing position is less, the electrical property is better, and the
cell conversion efficiency is high. In addition, after the silicon wafer is textured and cleaned, a
pyramid textured surface can be formed at the
etching position, so that the influence of the silicon wafer on light absorption is avoided.