Piezoelectric module and electronic device

Abstract

The invention relates to a piezoelectric module and an electronic device. A piezoelectric module includes a substrate having a working surface; a piezoelectric unit, arranged on the working surface ofthe substrate, the piezoelectric unit being provided with a first side and a second side which are oppositely arranged in the direction parallel to the working surface, and the first side and the second side being each provided with a side electrode; a first extension electrode, arranged on one side, far away from the substrate, of the piezoelectric unit; a conductive bonding structure, arrangedbetween the substrate and the piezoelectric unit, or arranged on the substrate and positioned on the side edge of the electrode on the corresponding side of the piezoelectric unit, so that the piezoelectric unit is electrically connected with the substrate; a first insulation protection layer, arranged on the surface, far away from the substrate, of the piezoelectric unit and covering the first extension electrode; and a second insulating protection layer covering the side electrodes on the surfaces of the first side and the second side of the piezoelectric unit and extending to the working surface of the substrate from the first side and the second side, so that the conductive bonding structure is isolated from the outside.

Description

technical field [0001] The invention relates to a piezoelectric module, in particular to a piezoelectric module and an electronic device. Background technique [0002] Traditionally, a piezoelectric module includes a substrate and a piezoelectric unit disposed on the substrate. The piezoelectric unit is electrically connected to the substrate through a conductive adhesive structure. The conductive adhesive structure is either located between the piezoelectric unit and the substrate, or located on the substrate and at one side of the piezoelectric unit. However, no matter where the conductive bonding structure is located, the conductive bonding structure is at least partially exposed. Since the viscosity of the conductive adhesive structure is greatly affected by the temperature and humidity in the environment, it affects the stability of the electrical connection between the substrate and the piezoelectric unit, and further causes the electrodes connected to the conductive...

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Problems solved by technology

However, regardless of where the conductive bonding structure is located, the conductive bonding structure is at least partially exposed

Since the viscosity of the conductive adhesive structure is greatly affected by the temperature and humidity in the environment, it affects the stability of the electrical connection between the substrate and the piezoelectric unit, and further causes the electrodes connected to the conductive adhesive structure in the piezoelectric unit to be affected by the intruding water and oxygen. affected by erosion

In addition, due to the leakage of the side electrodes in the piezoelectric unit and the extension electrodes located on the side of the piezoelectric unit away from the substrate, the side electrodes and extension electrodes of the leakage are also susceptible to oxidation due to the influence of water and oxygen in the environment

All of the above will affect the electrical properties of the leaking side electrodes and extension electrodes due to oxidation, or affect the stability of the electrical connection between the positive electrode and the negative electrode and the substrate respectively, thereby affecting the electrical function of the piezoelectric module.

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