A miniaturized high-isolation ceramic packaging structure

A high-isolation, ceramic packaging technology, which is applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of high crosstalk and coupling effects in transmission channels, limited wiring space, and increased signal loss, etc., to reduce Effects of crosstalk and coupling effects, reduction of influence, and reduction of signal loss

Active Publication Date: 2017-07-28
CHENGDU CORPRO TECH CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limited wiring space of the bonding fingers, the RF bonding fingers are often not isolated from the left and right, and there are high crosstalk and coupling effects between the transmission channels, which will increase the loss of the signal and result in low isolation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A miniaturized high-isolation ceramic packaging structure
  • A miniaturized high-isolation ceramic packaging structure
  • A miniaturized high-isolation ceramic packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment one: if figure 1 As shown, a miniaturized high-isolation ceramic package structure includes a shell a, a chip b, a metal cover c, and a bonding wire d; the shell a is composed of a ceramic layer a1, a metallization layer a2, and an interconnection blind hole a3 The metallization layer a2 is composed of the bonding finger layer a21, the sealing area a22, the connection area a23, the sticky core area a24 and the printed line layer a25; the center of the shell a is provided with a sticky core for placing the chip b area a24; bonding finger layer a21 is provided around the sticky core area a24; the bonding finger layer a21 includes ground bonding finger a211 and signal bonding finger a212, and the ground bonding finger a211 is connected to the The printed wiring layer a25 is connected to the sealing area a22 and the core bonding area a24, and the signal bonding finger a212 is connected to the connection area a23.

[0025] The metallization layer area a2 is base...

Embodiment 2

[0031] Embodiment two: if Figure 4 As shown, the difference from the first embodiment is that the core bonding area a24 is in the same layer as the second printed wiring layer a252. Compared with Embodiment 1, the advantage is that the thickness of the shell a can be reduced, but at the same time, the mechanical reliability of the shell a can be reduced. Therefore, this form is mainly used in occasions where the shape of the shell a is small and the thickness of the shell a is required to be high.

Embodiment 3

[0032] Embodiment three: as Figure 5 As shown, the difference from the first embodiment is that the signal bonding finger a212 is interconnected with the connection area a23 through the interconnection blind hole a3 to realize electrical connection. Compared with the first embodiment, since there is no semicircular hole on the edge of the package a, the outer shape of the package a can be further reduced on the premise of ensuring the reliability of the package a, and the miniaturization of the package can be realized. However, it is necessary to reduce the influence of the interconnection blind hole a3 on the mechanical properties of the shell a as much as possible, and the position of the hole needs to be moved inward, which will shorten the wiring length of the bonding finger layer a21 and increase the difficulty of wiring. Therefore, this form is mainly used in occasions where the requirement for isolation is not high, and the requirements for the shape and size of the sh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a minimized high-isolation ceramic packaging structure including a pipe case (a), a chip (b), a metal cover plate (c) and a bonding wire (d); the pipe case (a) is composed of a ceramic layer (a1), a metallization layer (a2) and an interconnection blind hole (a3); the metallization layer (a2) is composed of a bonding finger layer (a21), a sealing area (a22), a connection area (a23), a bonding chip area (a24) and a printed circuit board trace layer (a25); the pipe case(a) is provided in the center thereof with the bonding chip area (a24) for displacing the chip, and the circumference of the bonding chip area (a24) is provided with the bonding finger layer (a21) which includes a grounding bonding finger (a211) and a signal bonding finger (a212). The structure herein has the beneficial effects that stratum isolation technology is adopted, and space stereo-wrapping is conducted on the high-isolation bonding finger, and a space "sandwich" structure is formed; the structure can markedly reduce cross talk and coupling effect of the signal channels, reduce signal loss, increase isolation level, and reduce impact of packaging on the electrical property of the products, provided that the high reliability of the packaging is guaranteed by the structure.

Description

technical field [0001] The invention relates to the technical field of integrated circuit ceramic packaging, in particular to a miniaturized high-isolation ceramic packaging structure. Background technique [0002] As the frequency of integrated circuits becomes higher and higher, the impact of packaging on the electrical performance of products is increasing; the parasitic parameters of packaging not only affect the electrical performance of RF IOs, but also affect the work of adjacent IOs; with the post-Moore era With the continuous development, the shape of integrated circuits is getting smaller and smaller, which increases the difficulty of designing high-frequency integrated circuit ceramic shells. [0003] From the top to the bottom of the traditional ceramic shell, it is the sealing area, the ceramic layer, the bonding finger layer, the ceramic layer, and the connection area. This layout does not isolate the RF IO, which will seriously affect the electrical performan...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/16195
Inventor 周平
Owner CHENGDU CORPRO TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap