Copper-slag-based ferritic oxalate chemical bonded material and application thereof

A technology for oxalate chemistry and bonding materials, which is applied in the field of copper slag-based iron-based oxalate chemical bonding materials, and achieves the concept of reducing waste and pollution, reducing production costs, and achieving good effects.

Active Publication Date: 2016-10-12
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, oxalate chemical bonding materials are relatively rare, and there are few reports on the use of oxalate chemical bonding materials to solidify arsenic-containing waste residues

Method used

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  • Copper-slag-based ferritic oxalate chemical bonded material and application thereof
  • Copper-slag-based ferritic oxalate chemical bonded material and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: The raw material composition of the copper slag-based iron-based oxalate chemical bonding material is 400 g of copper slag, 100 g of oxalic acid, and 8 g of desulfurized gypsum. The copper slag is ground to a particle size of 200 mesh sieve and the balance is not more than 10%;

[0025] The above-mentioned copper slag-based iron-based oxalate chemical bonding material is used as a pouring material. Mix 600 g of copper-based iron-based oxalate chemical bonding material with 120 g of water at room temperature and then cast it into shape. The solidification time is 30 minutes , demoulded after 1 day, and its mechanical properties were tested when it was maintained in the natural environment for 3d, 7d, and 28d. The compressive strengths of 3d, 7d, and 28d were 19.2Mpa, 32.4Mpa, and 42.1Mpa respectively; XRD phase analysis was performed on the material , see the result figure 1 , it can be seen from the figure that the material contains ferrous oxalate, calcium o...

Embodiment 2

[0026] Example 2: The raw material composition of the copper slag-based iron-based oxalate chemical bonding material is 300 g of copper slag, 100 g of oxalic acid, and 6 g of desulfurized gypsum. The copper slag is ground to a particle size requirement of 200 mesh sieve and the balance is not more than 10%;

[0027] The above-mentioned copper slag-based iron-based oxalate chemical bonding material is used as a pouring material. Mix 600 g of the copper-slag-based iron-based oxalate chemical bonding material with 120 g of water at room temperature and then cast it into shape. The solidification time is 26 minutes. After 1 day, it was removed from the mold, and its mechanical properties were tested when it was maintained in the natural environment for 3d, 7d, and 28d. The compressive strengths of 3d, 7d, and 28d were 16.5Mpa, 21.4Mpa, and 31.5Mpa, respectively.

Embodiment 3

[0028] Example 3: The raw materials of the copper slag-based iron-based oxalate chemical bonding material are composed of 600 g of copper slag, 150 g of oxalic acid, and 12 g of desulfurized gypsum. The copper slag is ground to a particle size of 200 mesh sieve and the balance is not more than 10%;

[0029] The above-mentioned copper slag-based iron-based oxalate chemical bonding material is used as a pouring material. Mix 600 g of copper-based iron-based oxalate chemical bonding material with 120 g of water at room temperature and then cast it into shape. The solidification time is 36 minutes. , demoulded after 1 day, and its mechanical properties were tested when it was maintained in the natural environment for 3d, 7d, and 28d. The compressive strengths of 3d, 7d, and 28d were 18.7Mpa, 24.9Mpa, and 37.3 Mpa, respectively.

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Abstract

The invention discloses a copper-slag-based ferritic oxalate chemical bonded material and application thereof. The material is prepared from, by weight, 300-700 parts of copper slag, 100-200 parts of oxalic acid or acid oxalate and 6-14 parts of set controlling material; the material has excellent performance of high setting rate, large cohesive force and good durability. The chemical bonded material serving as a base material for curing arsenic-containing slag can effectively cure / stabilize the arsenic-containing slag in and solve the problem of environment pollution caused by the arsenic-containing slag.

Description

technical field [0001] The present invention relates to a copper slag-based iron-based oxalate chemical bonding material and its application, in particular to a method for preparing an iron-based oxalate chemical bonding material using copper slag discharged from a copper smelting process and the use of the material as a pouring material Or the application in the solidification of arsenic-containing waste residue belongs to the technical field of solid waste and arsenic pollution control. Background technique [0002] Arsenic is a metalloid element. With the gradual enrichment of arsenic in the flow direction of non-ferrous metal mining, dressing, and smelting, various arsenic-containing waste residues are formed. Among environmental chemical pollutants, arsenic has become one of the most common pollutants and the most serious hazard to public health. Arsenic pollution and arsenic poisoning are worldwide pollution problems. China is one of the countries most seriously poll...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B12/00C04B7/153
CPCC04B7/153C04B12/00Y02P40/10
Inventor 周新涛何欢史桂杰张明琴汪霞罗中秋
Owner KUNMING UNIV OF SCI & TECH
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