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Method and system for cleansing wafer in cmp process of semiconductor manufacturing fabrication

A technology for semiconductors and wafers, applied in the field of cleaning wafers

Active Publication Date: 2016-10-12
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] While existing methods and devices commonly used for cleaning semiconductor wafers after a CMP process have served their intended purpose, they have not been completely satisfactory in all respects

Method used

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  • Method and system for cleansing wafer in cmp process of semiconductor manufacturing fabrication
  • Method and system for cleansing wafer in cmp process of semiconductor manufacturing fabrication
  • Method and system for cleansing wafer in cmp process of semiconductor manufacturing fabrication

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Embodiment Construction

[0037] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which the first component and the second component may be formed An embodiment of an additional component such that the first component and the second component may not be in direct contact. In addition, the present invention may repeat reference numerals and / or characters in various instances. This repetition is for the purposes of simplicity and clarity and does not in itself indicate a relationship b...

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Abstract

A method for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process is provided. The method includes providing the semiconductor wafer into a cleaning module. The method further includes cleaning the semiconductor wafer by rotating a cleaning brush assembly. The method also includes applying an agitated cleaning liquid to clean the cleaning brush assembly.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more particularly, to methods and systems for cleaning wafers in the CMP process of semiconductor manufacturing processes. Background technique [0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. The semiconductor industry continues to improve the integration of various electronic components (eg, transistors, diodes, resistors, capacitors, etc.) through continued reductions in minimum feature size, which allows more components to be integrated into a given area. In some applications, these smaller electronic components also require smaller packages that utilize less area than previous packages. [0003] During the fabrication of semiconductor devices, various processing steps are used to fabricate integrated circuits on semiconductor wafers. Typically, the process incl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02052H01L21/67046H01L21/02065H01L21/02074B24B37/20B24B37/34B08B1/52B08B1/14B08B1/12H01L21/67028B08B3/12B08B1/00B08B1/32B08B1/50
Inventor 田家穎薛家麟
Owner TAIWAN SEMICON MFG CO LTD