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Method of forming plated through holes in printed circuit boards

A technology for printed circuit boards and conductive materials, which is applied in the fields of printed circuit manufacturing, electrical connection formation of printed components, printed circuits, etc., and can solve problems such as stripping of conductive coatings and unstable results

Active Publication Date: 2019-11-26
SANMINA-SCI CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, when the backdrilled bit has no pressure and it pushes up against the trace on top, instability results and stripping of the conductive plating occurs

Method used

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  • Method of forming plated through holes in printed circuit boards
  • Method of forming plated through holes in printed circuit boards
  • Method of forming plated through holes in printed circuit boards

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Embodiment Construction

[0055] Although the present disclosure provides methods for forming plated through holes in multilayer printed circuit boards, the present disclosure is not limited to use with PCBs. A multi-layer PCB can be a package substrate, motherboard, line card, puddle card, backplane, middle board, flexible or rigid-flex circuit. The via structure may be a plated through hole (PTH) for carrying electrical signals from one conductive layer to another. The plated via structure may also be a component mounting hole for electrically connecting the electrical component to other electrical components on the PCB.

[0056] Removal of long stubs

[0057] Figure 2A1, Figure 2A2 and Figure 2B to Figure 2D Illustrated are different manufacturing stages for forming plated through holes (or vias) in a printed circuit board (PCB) and removing long stubs, according to one aspect. As described below, the final drill direction prevents the cut edges of plated corners from peeling off.

[0058] A lo...

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PUM

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Abstract

A method of forming plated through holes in a printed circuit board. The present invention relates to printed circuit boards PCBs, and more particularly, to methods of forming high aspect ratio vias and high precision stub removal in printed circuit boards PCBs. This high precision stub removal process can be utilized when removing long and short stubs. In the method, a plurality of holes of different diameters and depths are drilled from the upper surface and / or the lower surface of the printed circuit board using drills of different diameters.

Description

[0001] This patent application claims priority to U.S. Provisional Application No. 61 / 930456, filed January 12, 2014, entitled "METHODS OF FORMING HIGHASPECT RATIO PLATED THROUGH HOLES AND HIGH PRECISION STUB REMOVAL IN APRINTED CIRCUIT BOARD," assigned to to this assignee and is hereby expressly incorporated herein by reference. technical field [0002] The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in printed circuit boards. Background technique [0003] Consumers increasingly demand faster and smaller electronic products. The use of PCBs has grown tremendously as new electronic applications come to market. A PCB is formed by laminating multiple conductive layers with one or more non-conductive layers. As the size of a PCB shrinks, the relative complexity of its electrical interconnection grows. [0004] Via structures have traditionally been use...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/42
CPCH05K1/0216H05K3/24H05K2201/09845H05K2203/0207H05K2203/0242H05K2203/072H05K2203/0723H05K3/429
Inventor D·W·托马斯S·伊克塔尼D·克斯滕
Owner SANMINA-SCI CORPORATION
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