Terminal local shielding method

Abstract

The invention relates to a terminal local shielding method, and the method comprises the following steps: S1, preprocessing: enabling a base film for forming a terminal to be placed in a base film groove, dragging the base film forwards through a material dragging mechanism, and carrying out the dust removal of the surface of the base film through a dust removing device; S2, punch forming: leading the base film into a punch forming die, enabling the punch forming fie to carry out the punch forming of the base film, and obtaining the terminal; S3, film pasting: enabling a part, which does not need to be electroplated, of the terminal to be pasted with an insulating film; S4, inspection: detecting the film pasting quality of the terminal; S5, electroplating: enabling the terminal to be placed into an electroplating groove, and carrying out the plating of a conductive film on the surface of the terminal; S6, insulating film removing: peeling off the insulating film on the terminal plated with the conductive film, and obtaining a terminal product. The method is advantageous in that the method is high in production efficiency, and is low in reject percentage.

Description

technical field [0001] The invention relates to the technical field of production of electronic components, in particular to a partial terminal shielding method. Background technique [0002] Electronic components are the foundation of the information industry and belong to the high-tech industry with broad prospects for development. In the next few years, miniaturization will still be one of the most important development trends of electronic components. The processing technology of electronic components is also more and more people's attention. [0003] Terminals are one of the electronic components. Most of them need to be plated with a conductive film on the surface of the terminal, but some terminal surfaces do not need to be completely plated with a conductive film. Since the terminal is a small component, a conductive film is plated on the traditional terminal part. All the conductive film is first plated, and then the conductive film is removed according to the pos...

AI Technical Summary

Problems solved by technology

[0003] Terminals are one of the electronic components. Most of them need to be plated with a conductive film on the surface of the terminal, but some terminal surfaces do not need to be completely plated with a conductive film. Since the terminal is a small component, a conductive film is plated on the traditional terminal part. All the conductive film is first plated, and then the conductive film is removed according to the position on the surface of the terminal that does not need to be plated with the conductive film. This production process is extremely inefficient, and it is easy to damage the parts that need to be plated when removing the conductive film. resulting in a large amount of waste