Array substrate, display panel and display device

An array substrate and substrate technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of increasing the overall height of the fan-out structure, unfavorable narrow frame design of display panels, etc., and achieve the effect of narrow frame design

Inactive Publication Date: 2017-02-22
XIAMEN TIANMA MICRO ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the single-layer wiring in the prior art tends to increase the overall height of the fan-out structure, which is not conducive to the narrow bezel design of the display panel

Method used

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  • Array substrate, display panel and display device
  • Array substrate, display panel and display device
  • Array substrate, display panel and display device

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Embodiment Construction

[0018] The principles and features of the present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0019] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0020] Please refer to figure 2 , which shows a schematic structural diagram of an embodiment of the array substrate provided by the present application. As shown in the figure, the array substrate of the present application includes: a substrate 21 , a data line 23 for...

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Abstract

The invention discloses an array substrate, a display panel and a display device. The array substrate comprises a substrate, a scanning line, a data line, data transmission signal lines and a driving chip. The at least one data transmission signal line comprises a first section and a second section, the first section and the second section are formed on different conductor layers relative to the substrate, the first section comprises a first end and a first overlapping part connected with the first end, the second section comprises a second end and a second overlapping part connected with the second end, the first end and the second end are electrically connected through a connecting hole formed in an insulating layer arranged between a first conductor layer and a second conductor layer, and an included angle alpha between a first direction and an orthographic projection of a connecting line of the first end and the second end on the substrate meets that alpha is larger than or equal to 0 degrees and smaller than or equal to 90 degrees. The first overlapping part and the second overlapping part cover the connecting hole and are at least partially overlapped in the direction perpendicular to the substrate. Two layers of routing of the data transmission signal lines can be implemented through the execution mode, and the execution mode is favorable for narrow frame design.

Description

technical field [0001] The present application relates to the field of display technology, and in particular to an array substrate, a display panel including the above-mentioned array substrate, and a display device including the above-mentioned display panel. Background technique [0002] In an existing display panel, a driver chip usually provides data signals to each data line, so as to realize the display of a predetermined picture. Therefore, a fan-out structure with multiple fan-out lines is generally used to connect the data lines to the solder pins of the driver chip. Since the distance between the adjacent data lines is much larger than the distance between the adjacent welding feet of the driver chip, the distance between each data line and the welding feet is different. In addition, the resistance of the fan-out lines with different lengths is different, so the problem of uneven distribution of the resistance of the fan-out lines may arise. [0003] In the prior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1362
CPCG02F1/136227G02F1/136286G02F1/136295
Inventor 刘冰萍曹兆铿周秀峰黄燕珊
Owner XIAMEN TIANMA MICRO ELECTRONICS
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