Cooling device for heating element and method for manufacturing the cooling device
A heating element and cooling device technology, applied in the computer field, can solve the problems of lowering the surface temperature of heating elements, fewer surface vaporization cores, and poor boiling performance, and achieve the effects of increasing vaporization cores, improving boiling performance, and efficient heat dissipation
Active Publication Date: 2019-02-15
DAWNING INFORMATION IND BEIJING +1
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] Aiming at the problem of less surface vaporization cores and poor boiling performance of heating elements such as CPUs in the related art, the present invention proposes a cooling device for heating elements and a manufacturing method of the cooling device, which can increase the number of vaporization cores and enhance the boiling performance of heating elements. Reduce the surface temperature of heating elements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.
[0025] According to an embodiment of the present invention, a cooling device for a heating element is provided.
[0026] Also refer to figure 2 and image 3 , the cooling device of the heating element according to the embodiment of the present invention includes: a metal substrate 21 arranged above the heating element and covering the heating element (not shown); the metal substrate 21 is in contact with the surface of the heating element; and the metal substrate 21 is away from the heating...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| porosity | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a heating element cooling device and a manufacturing method of the cooling device. The cooling device comprises: a metal substrate arranged above the heating element and covering the heating element; the metal substrate is in contact with the surface of the heating element; The surface of the heating element includes: a porous metal covering layer, which is located above the heating element and covers the heating element. By arranging a metal substrate with a porous metal covering layer on the surface of the heating element, the vaporization core is increased, the boiling performance of the heating element is improved, and an efficient heat dissipation effect on the surface temperature of the heating element is realized.
Description
technical field [0001] The present invention relates to the field of computer technology, in particular to a cooling device for heating elements of an immersion liquid cooling server and a manufacturing method of the cooling device. Background technique [0002] In addition to the common air-cooling method that relies on cold air to dissipate heat for the computer, there is also a liquid-cooling method, which directs the coolant directly to the heat source, while the air-cooling method is indirect refrigeration; The heat transferred, that is, the heat dissipation efficiency, can reach 3500 times that of the air-cooled cooling method. Liquid cooling radiators appeared in the market around 2008. Server manufacturers such as HP and IBM and other companies focusing on data center technology have successively launched liquid cooling products. [0003] Evaporative cooling is a cooling method that uses the latent heat of vaporization when the fluid boils to remove heat from the th...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/20H05K7/2029H05K7/20809H05K7/20309H05K7/203H01L23/3736H01L23/44H01L21/4871G06F2200/201H05K7/20236H05K7/20254H01L23/34
Inventor 沈卫东王晨吴宏杰李星彭晶楠孙振崔新涛陈进
Owner DAWNING INFORMATION IND BEIJING