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Method and device for testing substrate warpage

A technology for testing substrates and substrates, applied in measuring devices, instruments, etc., can solve the problems of unfavorable film substrate quality monitoring efficiency and few online tests, and achieve the effect of improving quality monitoring efficiency and good timeliness

Inactive Publication Date: 2017-03-08
KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides a method and device for testing substrate warpage, which is used to solve the problem that in the prior art, substrate warpage tests are mostly static and offline tests, and there are few online tests, which is not conducive to improving the efficiency of film substrate quality monitoring.

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  • Method and device for testing substrate warpage
  • Method and device for testing substrate warpage
  • Method and device for testing substrate warpage

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Embodiment Construction

[0038] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0039] figure 1 It is a schematic flowchart of a method for testing substrate warpage provided in the embodiment of the present application.

[0040] figure 1 A process in can include the following steps:

[0041] S101: Bring the substrate contact unit closer to the substrate, and determine the first time elapsed when the contact sensor provided on...

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Abstract

The invention disclose a method and a device for testing substrate warpage, wherein the method and the device are used for setting a problem of no thin-film substrate quality monitoring efficiency increase caused by a fact that substrate warpage tests in prior art are commonly stationary and offline tests and seldom online test is performed. The method comprises the steps of making a substrate contact unit approach a substrate, and defining a first time period to a time point when a contact sensor arranged on the substrate contact unit contacts with the surface of the substrate; after a film is formed on the substrate, making the substrate contact unit approach the substrate after film forming, and defining a second time period to a time point when the contact sensor contacts with the surface of the substrate after the film is formed; and determining the warpage value of the substrate after film forming according to the first time period, the second time period and motion speed of the substrate contact unit.

Description

technical field [0001] The present application relates to the technical field of substrate testing, in particular to a method and device for testing substrate warpage. Background technique [0002] After the substrate film is formed in the thin film substrate process, the warpage of the thin film substrate becomes a major factor affecting the quality of the thin film substrate. The warpage of the thin film substrate will cause the wavefront distortion of the emitted light beam when the light wave is incident on the film on the thin film substrate. What's more, the stress of the film may cause the performance of the film to deteriorate or even cause the film to crack and peel off. [0003] It is an indisputable fact that the display, semiconductor and other industries have gradually become stricter on the quality requirements for surface warpage of substrates represented by glass plates and tempered glass used in the industry. At present, substrate warpage tests are mostly s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/32
CPCG01B21/32
Inventor 郭瑞贺良伟徐磊赵景训卜凡中俞凤至
Owner KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT
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