Wafer alignment device

Abstract

An alignment device for a wafer in an industrial process assembly includes an inner surface shaped to conform to an outer surface of a wafer, an outer surface comprising at least two cams; and two ends connecting the inner surface to the outer surface. The two ends are positioned such that when the alignment device is positioned on the outer surface of the wafer, the alignment device extends more than one hundred eighty degrees around the wafer.

Description

technical field [0001] The present disclosure relates to process control systems. In particular, the present disclosure relates to wafers and flanges in industrial processes. Background technique [0002] In processing equipment, fluids are piped to individual processing elements. A pipe consists of individual pipe sections connected together by fittings. Components such as sensors and valves can be introduced into the pipeline by placing these components between the fittings of the two pipeline parts. [0003] In a common configuration, a clip is placed between the two pipe sections. The clip includes an outer ring annularly positioned around at least one fluid flow channel. One or more holes extend through the outer ring in radial direction. A sensor may be introduced through the radial hole to interact with the fluid and / or a pipe may be introduced into the radial hole to direct fluid flow to a sensor mounted outside the pipe. Additionally, orifice plates, averaging...

AI Technical Summary

Problems solved by technology

However, these levels of accuracy are only valid if the wafer ring is properly centered with respect to the center of the adjacent pipe section

If the center of the clip ring deviates from the center of the pipe section by more than the specified allowable off-center value, the measuring device will not be able to provide measurements with the specified accuracy

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