Surface metallization treatment method of polyimide fibers

A polyimide fiber, surface metal technology, applied in fiber processing, fiber types, textiles and papermaking, etc., to achieve the effect of broad market prospects, uniform coating, and expansion of application fields

Inactive Publication Date: 2017-05-10
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used fiber surface metallization methods include sputtering method, coating method, chemical plating method and electrodeposition method, etc. Among them, the chemical plating method is a relatively effective fiber metallization method, and the required process is simple. The quality of the coating is stable, it has little influence on the properties of the base material, and it can be applied to materials of any complex shape. At present, there are relatively few reports on the surface metallization of polyimide fibers

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A kind of polyimide fiber surface metallization treatment method, the steps are as follows:

[0029] (1) polyimide fiber is ultrasonically cleaned and dried in acetone;

[0030] (2) Coarse the polyimide fiber in the mixed solution of potassium permanganate and sodium hydroxide at 40°C for 1 min, the concentration of potassium permanganate in the mixed solution of potassium permanganate and sodium hydroxide is 40g / L, hydrogen The concentration of sodium oxide is 60g / L;

[0031] (3) The polyimide fiber is activated at 30° C. for 3 min in an ionic palladium complex solution with a concentration of palladium ions of 150 mg / L;

[0032] (4) Reducing the polyimide fiber at 20° C. for 3 minutes in a dimethylammonia borane solution with a concentration of 0.5 g / L, so that the ionic palladium adsorbed on the surface of the fiber is reduced to metal palladium;

[0033] (5) The polyimide fiber is placed in the chemical copper solution, and the method of electroless copper plating...

Embodiment 2

[0035] A kind of polyimide fiber surface metallization treatment method, the steps are as follows:

[0036] (1) polyimide fiber is ultrasonically cleaned and dried in acetone;

[0037] (2) Coarse the polyimide fiber in the mixed solution of potassium permanganate and sodium hydroxide at 50°C for 3 minutes, the concentration of potassium permanganate in the mixed solution of potassium permanganate and sodium hydroxide is 50g / L, hydrogen The concentration of sodium oxide is 70g / L;

[0038] (3) The polyimide fiber is activated at 35° C. for 4 minutes in an ionic palladium complex solution with a concentration of palladium ions of 180 mg / L;

[0039] (4) Reducing the polyimide fiber at 22° C. for 4 minutes in a dimethylammonia borane solution with a concentration of 2 g / L, so that the ionic palladium adsorbed on the surface of the fiber is reduced to metal palladium;

[0040] (5) Place the polyimide fiber in the chemical copper solution, and use the method of electroless copper p...

Embodiment 3

[0042] A kind of polyimide fiber surface metallization treatment method, the steps are as follows:

[0043] (1) polyimide fiber is ultrasonically cleaned and dried in acetone;

[0044] (2) Coarse the polyimide fiber in the mixed solution of potassium permanganate and sodium hydroxide at 60°C for 5 minutes, the concentration of potassium permanganate in the mixed solution of potassium permanganate and sodium hydroxide is 60g / L, hydrogen The concentration of sodium oxide is 80g / L;

[0045] (3) The polyimide fiber is activated at 40° C. for 6 minutes in an ionic palladium complex solution with a concentration of palladium ions of 200 mg / L;

[0046] (4) Reducing the polyimide fiber at a concentration of 3g / L in a dimethylammonia borane solution at 25°C for 6 minutes to reduce the ionic palladium adsorbed on the surface of the fiber to metal palladium;

[0047] (5) The polyimide fiber is placed in the chemical copper solution, and the method of electroless copper plating is used ...

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Abstract

The invention belongs to the field of surface metallization treatment of fiber materials and relates to a surface metallization treatment method of polyimide fibers. The surface metallization treatment method comprises the following steps: firstly, carrying out ultrasonic washing and drying on the polyimide fibers in acetone; roughening the polyimide fibers in a mixed solution of potassium permanganate and sodium hydroxide; then activating the polyimide fibers in an ion palladium complex solution; furthermore, reducing the polyimide fibers in a dimethylamine broane solution so as to reduce ion palladium adsorbed on the surfaces of the fibers into metal palladium; finally, putting the polyimide fibers into a chemical copper solution and depositing chemical copper on the surfaces of the polyimide fibers by adopting a chemical copper electroplating method, so as to prepare copper-plated polyimide fibers. According to the copper-plated polyimide fibers prepared by the surface metallization treatment method, the thickness of a surface plating layer is uniform and dense; the surface plating layer is firmly combined with a fiber matrix and the quality of the plating layer is good; the process is simple and industrialized production is easy to realize.

Description

technical field [0001] The invention belongs to the field of metallization treatment on the surface of fiber materials, and relates to a method for metallization treatment on the surface of polyimide fibers. Background technique [0002] With the rapid development of modern high-tech, the application is becoming more and more extensive, and the material research is constantly developing in the direction of high performance, multi-function, and lightweight. Due to its low density, high strength, excellent chemical corrosion resistance, thermal oxidation stability, radiation resistance, and low expansion, polyimide fiber is an ideal matrix material for the preparation of fiber-like conductive materials. Due to the characteristics of light weight, softness, and easy folding, fiber-based conductive materials not only have the functions of eliminating static electricity, electromagnetic shielding, detection and transmission of electrical signals, but also show superior performanc...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): D06M11/83D06M101/30
CPCD06M11/83D06M2101/30
Inventor李爽陈南梁蒋金华邵光伟傅婷
OwnerDONGHUA UNIV