A kind of nano material cutting processing method
A technology of nanomaterials and cutting processing, applied in the direction of nanotechnology, nanotechnology, nanostructure manufacturing, etc., to achieve the effect of wide application range, convenient operation, and suitable for popularization and application
Inactive Publication Date: 2018-11-09
ZHENGZHOU UNIV
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However, the cutting principles of these two methods in cutting nanomaterials determine that they are only suitable for nanomaterials with better conductivity.
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[0035] In this embodiment WS 2 Nanomaterial cutting processing method, the specific operation steps are:
[0036] 1) Insert the gold wire into the end of the TEM-STM sample rod where the sample is placed, and dip the multi-walled WS on the gold wire 2 nanotubes, such as figure 1 shown;
[0037] 2) Take a tungsten wire with a diameter of 0.2 mm and corrode it with NaOH solution to obtain a tungsten tip with a radius of curvature less than 100 nanometers, coat a layer of metal lithium on the surface of the tungsten tip in the glove box, and then put the tungsten tip into the TEM of step 1) -in the STM sample rod, and then put the TEM-STM sample rod into the TEM. During this process, the metal lithium on the surface of the tungsten tip is in contact with the air to form a layer of lithium oxide. 2 Nanotubes act as solid electrolytes during lithiation;
[0038] 3) The gold wire is used as the positive electrode, and the tungsten needle tip is used as the negative electrode. Th...
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The invention relates to the technical field of nanometer material processing, in particular to a nanometer material cutting processing method. The method comprises the steps of enabling a nanometer material to make contact with Li+ to conduct a lithiation reaction, and then exerting force on the nanometer material, so that the nanometer material breaks from the junction of the lithiated position and the non-lithiated position, and cutting of the nanometer material is achieved. According to the nanometer material cutting processing method, the nanometer material is lithiated and expanded to generate a stress effect by utilizing the mode of in-situ lithiation so that the nanometer material can break under pulling stress or bending stress at the junction of the lithiated position and the non-lithiated position, and thus cutting of the nanometer material is finished. The mechanism of cutting is related with the lithiation of the nanometer material, by controlling the lithiation velocity and the lithiation time, the controllability of the lithiation length of the nanometer material is achieved, accurate and controllable processing of cutting the nanometer material in the length direction is achieved, and cutting is not influenced by the thickness, the conductive capacity and the like of the processing material. The nanometer material cutting processing method is wide in applicable range, convenient to operate, easy to control, and suitable for being applied and popularized.
Description
technical field [0001] The invention relates to the technical field of nanomaterial processing, in particular to a method for cutting and processing nanomaterials. Background technique [0002] Since the 1990s, the status of nanomaterials in the field of scientific research has become increasingly important. Since the properties of nanomaterials are closely related to their size and shape, the controllable preparation of nanomaterials has always been an important goal pursued in the field of nanomaterial synthesis. However, at present, the controllable preparation of nanomaterials through physical or chemical synthesis methods is still a difficult point in the field of nanomaterial preparation, which greatly limits the further application of nanomaterials. There are few means of re-cropping topography and interconnecting them afterwards. [0003] The methods of chemical etching and mechanical grinding are commonly used methods for simple processing of nanomaterials, but th...
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IPC IPC(8): B82B3/00B82Y40/00B82Y30/00
CPCB82B3/00B82B3/0004B82Y30/00B82Y40/00
Inventor 许婷婷裴永永田永涛李新建
Owner ZHENGZHOU UNIV