Heat-conductive silica gel compound, heat-conductive silica gel material, heat-conductive silica gel slice and preparation method thereof

Abstract

The invention provides a heat-conductive silica gel compound. The heat-conductive silica gel compound contains a heat-conductive agent, an organic silica gel and other auxiliaries, wherein the heat-conductive agent is composed of heat-conductive filler, multilayer graphene and a coupling agent; the content of heat-conductive filler in the heat-conductive agent is 75-86wt%; the content of multilayer graphene in the heat-conductive agent is 2-13wt%; the content of coupling agent in the heat-conductive agent is 1-2.4wt%. The heat-conductive silica gel compound is high in mobility and high in filling capacity. The prepared heat-conductive silica gel slice has higher thermal conductivity and low coefficient of thermal expansion. The invention also provides a preparation method for the heat-conductive silica gel slice and the heat-conductive silica gel slice prepared according to the method.

Description

technical field [0001] The invention relates to a heat-conducting silica gel composition, a heat-conducting silica gel material prepared from the heat-conducting silica gel composition, a method for preparing a heat-conducting silica gel sheet, and a heat-conducting silica gel sheet prepared by the method. Background technique [0002] With the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and more multifunctional, and the assembly density of components is getting higher and higher. The heat dissipation of heating elements has become a prominent problem. If the accumulated heat cannot be dissipated in time, it will lead to an increase in the operating temperature of the components, which will directly affect the life and reliability of various high-precision equipment. Therefore, in order to better reduce the thermal resistance of the device and improve the overall heat transfer capability, it is necessary to use a ...

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Problems solved by technology

Due to the large specific surface area of ​​multilayer graphene, the inventor found through a large number of experiments that when it is used as a thermally conductive material in a certain proportion with thermally conductive fillers, the specific surface area of ​​multilayer graphene in contact with the substrate is large, resulting in increased interaction force. Large, the restraining force on the silicone oil resin molecules is strengthened, which inhibits the thermal expansion of the matrix, thereby reducing the thermal expansion coefficient of the thermally conductive silicone material; Coupling of powder can increase the filling amount of heat-conducting agent without reducing the fluidity of heat-conducting silica gel; and further reduce the coefficient of thermal expansion of heat-conducting silica gel, effectively improving thermal deformation of heat-conducting materials and causing extrusion problems to electronic components

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