Method for brazing single-layer diamond grinding wheel with high-entropy alloy in induction heating mode

A technology of single-layer diamond and diamond grinding wheel, which is applied in the production field of new-type solder brazing single-layer diamond grinding wheel, which can solve the problems of diamond abrasive grain falling off, difficult real-time exposure of diamond abrasive grain, and low hardness.

Active Publication Date: 2017-07-25
SUZHOU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the solders are mainly Ni-based and Cu-based. The higher Ni content in Ni-based solders will promote the graphitization of diamonds and cause excessive dissolution of diamonds. In addition, Ni-Cr-B-Si is usually a hard surface Alloy, its good wear resistance is easy to cause diamond abrasive grains to be difficult to expose in real time, and Cu in copper-based solder is not a catalyst, so it will not promote diamond graphitization, and Cu hardly dissolves diamond, but its hardness is low. The wear resistance of the solder is poor, which often leads to excessive wear of the solder layer and the loss of diamond abrasive grains

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1. A preparation method of induction heating brazing single-layer diamond grinding wheel comprises the following process steps:

[0015] Step 1. Select 45 steel as the grinding wheel base, and prepare the diamond grinding wheel base by mechanical processing, wherein the diameter of the grinding wheel base is 500mm.

[0016] Step 2, adopt the powder that Ni-Cr-B-Si, Cu, Ti, Sn, Mn metal powder mixes through ball milling as the solder of brazing diamond emery wheel, described Ni-Cr-B-Si, Cu , Ti, Sn, Mn metal powder mass percentage is 25:20:15:20:20; wherein the chemical composition of Ni-Cr-B-Si C is 1%, Cr is 18%, B is 4%, Si is 4%, Ni is 73%. The ball milling process is as follows: use a steel ball milling pot for ball milling and mixing, in which the mass ratio of balls to metal powder is 3.2:1, after sealing, open the vacuum valve to evacuate for 30 minutes, put the ball milling pot into a planetary ball mill, and the speed is 300r / min, the reverse frequency is 42...

Embodiment 2

[0023] 1. A preparation method of induction heating brazing single-layer diamond grinding wheel comprises the following process steps:

[0024] Step 1. Select 65Mn steel as the grinding wheel base, and prepare the diamond grinding wheel base by mechanical processing, wherein the diameter of the grinding wheel base is 600mm.

[0025] Step 2, adopt the powder that Ni-Cr-B-Si, Cu, Ti, Sn, Mn metal powder mixes through ball milling as the solder of brazing diamond emery wheel, described Ni-Cr-B-Si, Cu , Ti, Sn, Mn metal powder mass percentage is 26:17:14:23:20; wherein the chemical composition of Ni-Cr-B-Si C is 0.8%, Cr is 21%, B is 4%, Si is 3.2%, Ni is 71%. The ball milling process is as follows: use a steel ball milling pot for ball milling and mixing, in which the mass ratio of balls to metal powder is 3:1, after sealing, open the vacuum valve to evacuate for 25 minutes, put the ball milling pot into a planetary ball mill, and the speed is 300r / min, the reverse frequency i...

Embodiment 3

[0032] 1. A preparation method of induction heating brazing single-layer diamond grinding wheel comprises the following process steps:

[0033] Step 1. Select Q235 steel as the grinding wheel base, and prepare the diamond grinding wheel base by machining, wherein the diameter of the grinding wheel base is 700mm.

[0034] Step 2, adopt the powder that Ni-Cr-B-Si, Cu, Ti, Sn, Mn metal powder mixes through ball milling as the solder of brazing diamond emery wheel, described Ni-Cr-B-Si, Cu , Ti, Sn, Mn metal powder mass percentage is 25:15:15:25:20; wherein the chemical composition of Ni-Cr-B-Si C is 0.9%, Cr is 18%, B is 3.5%, Si is 4.5%, Ni is 73.1%. The specific ball milling process is as follows: use a steel ball mill jar for ball milling and mixing, in which the mass ratio of balls to metal powder is 3.5:1, after sealing, open the vacuum valve to evacuate for 20 minutes, put the ball mill jar into a planetary ball mill, and the speed is 350r / min, reversing frequency 30Hz, b...

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Abstract

The invention discloses a manufacturing method for brazing a single-layer diamond grinding wheel with high-entropy alloy in an induction heating mode. The method comprises the following steps of preparing a diamond grinding wheel base body through a machining method; high-entropy alloy powder prepared by mixing Ni-Cr-B-Si, Cu, Ti, Sn and Mn serves as brazing filler for brazing the diamond grinding wheel; the grinding wheel base body, pressure-sensitive adhesives, the brazing filler and diamond grains are placed in sequence, and a tool molding blank is manufactured; and finally, the diamond grinding wheel is brazed in the induction heating mode.

Description

technical field [0001] The invention belongs to the field of making superhard abrasive tools, and in particular relates to a method for making a novel single-layer diamond grinding wheel brazed with brazing material. Background technique [0002] With the development of science and technology, a large number of hard and brittle materials and various composite materials are widely used in various fields due to their advantages such as high strength, high hardness, and high wear resistance. Grinding with diamond tools is a very important type of processing method. Diamond abrasives are widely used to make superabrasive tools because of their excellent mechanical properties such as high hardness, high wear resistance, and high thermal conductivity. At present, in the field of diamond tool manufacturing, brazing technology can realize good chemical metallurgical bonding between diamond, bonding agent and metal matrix interface, and is widely used. Diamond tools have high techn...

Claims

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Application Information

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IPC IPC(8): B24D18/00B22F1/00C22C30/02C22C30/04
CPCB22F1/0003B24D18/0054C22C30/02C22C30/04
Inventor 卢金斌殷振刘威曹自洋朱其新张旺玺李扬徐帅仇鑫凯
Owner SUZHOU UNIV OF SCI & TECH
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