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A laser processing system and method with dynamically controllable laser focus position

A focus position, laser processing technology, applied in laser welding equipment, metal processing equipment, optics, etc., can solve the problems of low defocusing efficiency, laser processing error, delay time, etc., and achieve a good effect of laser focusing effect

Active Publication Date: 2018-10-19
WUHAN EXCEL SCI & TECH LTD EST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since this defocusing method is obtained by changing the distance between the flat-field focusing lens and the circuit board, in the process of laser processing, changing the distance between the flat-field focusing lens and the circuit board is likely to cause errors in laser processing , more importantly, by constantly changing the distance between the flat-field focusing lens and the circuit board to achieve the purpose of defocusing, the efficiency of such defocusing is too low, and it takes too much time

Method used

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  • A laser processing system and method with dynamically controllable laser focus position
  • A laser processing system and method with dynamically controllable laser focus position
  • A laser processing system and method with dynamically controllable laser focus position

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Experimental program
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Effect test

Embodiment 1

[0074] figure 1 It is a schematic diagram of the laser drilling system for double-sided copper foil flexible circuit boards, such as figure 1 As shown: the double-sided copper foil flexible circuit board laser drilling system mainly includes the laser light source module 1, the laser beam divergence angle dynamic control module 3 and the laser focusing and focus switching module 5.

[0075] The laser light source module 1 includes a laser source 101, and some optical path transmission transformation devices (not marked in the figure), such as beam expansion, reflection, refraction and other devices.

[0076] The laser beam divergence angle dynamic control module 3 includes a reflective optical element 301 , a quarter-wavelength glass slide 304 , a P polarization beam splitting device 307 or an S polarization beam splitting device 308 . The laser reflective surface of the reflective optical element 301 is set perpendicular to the optical path. It is better understood when th...

Embodiment 2

[0092] figure 2 It is a three-dimensional laser ultra-fine marking system according to Embodiment 2 of the present invention, except that the laser beam divergence angle dynamic control module 3 and figure 1 There are differences, but the others are the same.

[0093] figure 2 The workpiece 6 to be processed is a stainless steel sheet with a thickness of 100 microns. The optical path flow of this embodiment is similar to that of Embodiment 1, please refer to Fact 1 above.

[0094] In this embodiment, the reflective optical element 301 of the laser beam divergence angle dynamic control module 3 is a circular plane reflector, and its surroundings are fixed on a plane. When the actuator does not exert force on the reflective optical element 301, 301 is a plane reflector. When the cylindrical piezoelectric actuator does not apply pressure to 301, 301 is a convex reflector, and the degree of protrusion is related to the stroke of the cylindrical piezoelectric actuator. It i...

Embodiment 3

[0104] Embodiment 3, a laser processing method with dynamically controllable laser focus position.

[0105] The laser processing method provided in this embodiment includes the following steps:

[0106] S1, the processing laser beam is transmitted to the dynamic control module of the divergence angle of the incident laser through the optical path, and outputs the first laser beam with a controlled divergence angle;

[0107] S2, the first laser beam is focused by the laser focusing and focus switching module to form a focused beam, wherein, for the first laser beams with different divergence angles, the focus positions of the formed focused beams are different;

[0108] S3, controlling the focused beam to switch between different processing units of the workpiece to be processed by the laser focusing and focus switching module or performing motion control on the laser focus scanning movement of the focused beam at a processing unit;

[0109] Wherein, the divergence angle of th...

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Abstract

The invention provides a laser processing system and method with a dynamically controllable laser focus position. The system includes a laser light source module, a laser beam divergence angle dynamic control module, and a laser focus and focus switch module. The present invention introduces a laser beam divergence angle dynamic control module in the entire laser processing system to dynamically control the divergence angle of the processing laser beam, thereby changing the laser focus after being focused by the laser focusing and focus switching module on the workpiece to be processed The spatial position realizes the high-speed defocusing movement of the laser focus, and can ensure the extremely high position accuracy of the laser focus center before and after defocusing and the laser defocusing focus center on the workpiece to be processed, and no additional aberration is introduced before and after defocusing , to ensure a good focusing effect before and after defocusing.

Description

technical field [0001] The invention relates to the technical field of laser processing, and more specifically, to a laser processing system and method with dynamically controllable laser focus positions. Background technique [0002] In the field of laser drilling, the laser focus is switched between holes. At present, galvanometer scanning is a relatively mature and fastest switching method, which shows acceleration and deceleration, linear displacement speed and positioning speed. [0003] But at present, blind hole drilling of circuit boards, without exception, uses a laser with specific parameters to remove the copper skin, and then changes the distance between the flat-field scanning focusing mirror and the circuit board to obtain the laser distance between the laser focus and the circuit board. Focus, use a large defocused spot to remove the material at the bottom of the hole. [0004] Since this defocusing method is obtained by changing the distance between the flat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B27/09G02B26/00B23K26/046B23K26/064B23K26/082
CPCB23K26/048B23K26/064B23K26/082
Inventor 张立国
Owner WUHAN EXCEL SCI & TECH LTD EST