Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Machining control device, laser machining device, and laser control method

A control device and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of inability to laser process workpieces, and achieve the effect of high-efficiency laser processing

Active Publication Date: 2015-07-22
MITSUBISHI ELECTRIC CORP
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, laser processing cannot be performed on the workpiece while the XY table is moving, and time loss occurs during laser processing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Machining control device, laser machining device, and laser control method
  • Machining control device, laser machining device, and laser control method
  • Machining control device, laser machining device, and laser control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0030] figure 1 It is a figure which shows the structure of the laser processing apparatus concerning Embodiment 1. The laser processing apparatus 100 is an apparatus for performing hole processing for forming a through hole or the like of a printed wiring board on a workpiece (work to be processed) W described later. The laser processing apparatus 100 of this embodiment moves the XY table 9 in a stepwise manner, and when the galvano region becomes the desired coordinates (target coordinates) by moving the XY table 9, the XY table 9 stops until the XY table 9 stops. So far, laser processing has been performed using coordinated control. Then, when the XY table 9 stops and the galvano area becomes the desired coordinates, the laser processing apparatus 100 performs laser processing in a state where the XY table 9 is stopped.

[0031] The laser processing device 100 has: a control device (processing control device) 200, amplifiers 31x, 31y, 32x, 32y, motors 5x, 5y, XY table 9, ...

Embodiment approach 2

[0096] Next, use Figure 10 and Figure 11 Embodiment 2 of the present invention will be described. In Embodiment 2, laser processing is performed by the same processing procedure as in Embodiment 1, using the rear end portion in the moving direction in the processing area as the coordinated control area.

[0097] Figure 10 It is a figure for demonstrating the process procedure of the laser processing process concerning Embodiment 2. Here, a case where laser processing is performed in the order of the processing area 10 - 1 to the processing area 10 - 6 will be described. In this embodiment, the laser processing apparatus 100 performs the movement processing and cooperative control processing of the XY table 9 similarly to the case of Embodiment 1. As shown in FIG.

[0098] The cooperative control area of ​​this embodiment is the rear end part of the movement direction in a processing area. exist Figure 10 , each cooperative control area of ​​the processing areas 10-2 ...

Embodiment approach 3

[0106] Next, use Figure 12 , Embodiment 3 of the present invention will be described. In Embodiment 3, laser processing using cooperative control is started when the processing area enters the galvano area. Then, after the laser processing in the cooperative control area is completed, the laser processing is temporarily stopped, and after the movement of the XY table 9 is completed, the laser processing other than the cooperative control area is performed.

[0107] Figure 12 It is a figure which shows the processing procedure of the laser processing process concerning Embodiment 3. exist Figure 12 , a cross-sectional view of the workpiece W is shown. Figure 12 The shown process (S31) is the same process as the process (S11) demonstrated using FIG. 6-2 of Embodiment 1. FIG. That is, when the processing area 82 on the workpiece W is outside the galvano area 81 ( S31 ), laser processing is not performed.

[0108] Then, when the processing area 82 on the workpiece W ente...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In the present invention, when a control device that controls an XY table (9) and a galvano scanner moves a machining area (82) on a machining subject to a galvano area, when the machining area (82) enters an in-position range having a pre-set distance from the target coordinates of motion, cooperative control for positioning a laser light within the galvano area is started while moving the XY table (9) without stopping, and the cooperative control is executed until the machining area (82) reaches the galvano area and the XY table is halted, by which means the cooperative control region in the machining area (82) is subjected to laser machining, and when the machining area (82) reaches the galvano area and the XY table is halted (9), the remaining machining regions in the machining area (82) are subjected to laser machining in the state of the XY table (9) being halted, thus easily improving the machining efficiency.

Description

technical field [0001] The present invention relates to a processing control device used in laser processing of a workpiece, a laser processing device, and a processing control method. Background technique [0002] As one of devices for processing workpieces (objects to be processed) such as printed boards, there is a laser processing device (micro laser processing machine) that irradiates a laser beam to a workpiece to perform hole drilling. In such a laser processing apparatus, after the XY table on which the workpiece is placed is moved and stopped, the galvano scanner is scanned to perform laser processing in the galvano region (stepping method). In this stepping method, the process of moving and stopping the XY stage on the surface of the workpiece is repeated, and after performing laser processing in the galvano region, the XY stage is moved and stopped in the next galvano region. . Therefore, laser processing cannot be performed on the workpiece while the XY table i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/08B23K26/082
CPCB23K26/0853B23K26/0807B23K26/082
Inventor 池见笃
Owner MITSUBISHI ELECTRIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com