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Anti-electromagnetic-interference and anti-static packaging material

A technology for anti-electromagnetic interference and packaging materials, applied in layered products, metal layered products, synthetic resin layered products, etc., can solve problems such as limited ability to prevent electromagnetic interference, achieve good pressure resistance, and simple production process Effect

Inactive Publication Date: 2017-08-04
广西点图包装有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although a small number of packaging materials are advertised as anti-electromagnetic interference, their actual anti-electromagnetic interference capabilities are extremely limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An anti-electromagnetic interference and anti-static packaging material, including an inner layer, an intermediate layer, and an outer layer, is characterized in that the inner layer is soft PVC coated with wire mesh, the middle layer is an anti-static sponge, and the outer layer is of low-density polyethylene.

[0019] Wherein, the middle layer is bonded with the inner and outer layers by an adhesive; the metal wire is stainless steel wire or phosphor copper wire; the specification of the wire mesh is 50 mesh; the antistatic sponge It is processed by adding conductive substances to plastics; the surface resistance of the antistatic sponge is less than 1×10 7 Ω; the antistatic sponge is a soft sponge.

Embodiment 2

[0021] An anti-electromagnetic interference and anti-static packaging material, including an inner layer, an intermediate layer, and an outer layer, is characterized in that the inner layer is soft PVC coated with wire mesh, the middle layer is an anti-static sponge, and the outer layer is of low-density polyethylene.

[0022] Wherein, the middle layer is bonded with the inner and outer layers through an adhesive.

[0023] The metal wires are stainless steel wires or phosphor copper wires.

[0024] The specification of the wire mesh is 80 mesh.

[0025] The antistatic sponge is processed by adding conductive substances to plastics.

[0026] The surface resistance of the antistatic sponge is less than 1×10 7 Ω.

[0027] Described antistatic sponge is soft sponge.

Embodiment 3

[0029] An anti-electromagnetic interference and anti-static packaging material, including an inner layer, an intermediate layer, and an outer layer, is characterized in that the inner layer is soft PVC coated with wire mesh, the middle layer is an anti-static sponge, and the outer layer is of low-density polyethylene.

[0030] Wherein, the middle layer is bonded with the inner and outer layers through an adhesive.

[0031] The metal wires are stainless steel wires or phosphor copper wires.

[0032] The specification of the wire mesh is 100 mesh.

[0033] The antistatic sponge is processed by adding conductive substances to plastics.

[0034] The surface resistance of the antistatic sponge is less than 1×10 7 Ω.

[0035] Described antistatic sponge is soft sponge.

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Abstract

The invention discloses an anti-electromagnetic-interference and anti-static packaging material. The packaging material comprises an inner layer, a middle layer and an outer layer, wherein the inner layer is soft PVC coated with a 50-100-mesh metal wire mesh, the middle layer is anti-static sponge, and the outer layer is low density polyethylene with relatively high mechanical strength; and the anti-static sponge is bonded with the inner layer and the outer layer through a bonding agent. The anti-electromagnetic-interference and anti-static packaging material in a three-layer structure has very good electromagnetic interference resistance, shock resistance and static electricity resistance; and a production process is simple, and the packaging material can be widely used for packaging static sensitive devices such as electronic components, integrated circuits, instruments and meters.

Description

technical field [0001] The invention relates to the field of packaging materials, in particular to an anti-electromagnetic interference and anti-static packaging material. Background technique [0002] The harm of electrostatic discharge to electronic products cannot be ignored. Statistics show that the economic damage caused by electrostatic damage to electronic products in the world every day may reach more than one million US dollars, about 5 billion US dollars a year. In a representative large-scale cmos device manufacturing plant, 28% of the returned devices due to quality problems in the first 7 months after leaving the factory are related to electrostatic damage, accounting for the first failure rate. [0003] There are also various electromagnetic interferences in the external environment of electronic products. External interference refers to the influence of electromagnetic waves other than the signals that electronic products need to receive on products. Such int...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/08B32B5/18B32B7/12B32B27/06B32B27/32B32B27/30B32B27/12B32B15/02B32B15/082
CPCB32B5/028B32B5/18B32B7/12B32B27/06B32B27/12B32B27/304B32B27/32B32B2307/21B32B2307/56
Inventor 庞瑜
Owner 广西点图包装有限公司
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