Anti-crack circuit board
A technology for circuit boards and multi-layer circuit boards, applied in printed circuit parts, printed circuit stress/deformation reduction, etc., can solve the problems of high labor intensity, high input cost of adhesive tape, low efficiency, etc. Effect
Inactive Publication Date: 2017-08-18
铜陵安博电路板有限公司
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, this method of manually pasting the adhesive tape to fix the anti-crack circuit board is labor-intensive, low in efficiency, and the cost of the adhesive tape is high, which cannot better meet the current SMT production needs.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0010] Embodiment 1: A crack-proof circuit board, the first circuit layer 1 has a first signal line, and has a first side and a second side; has a second signal line 2, which is arranged on the first signal line On the lower side, metal blocks 3 are arranged on the edge of the second signal line 2, and the metal blocks 3 are structurally separated from each other, and at least one internal circuit layer is arranged inside, which is located between the first surface and the second surface. The anti-crack circuit board is a multi-layer anti-crack circuit board with multi-layer internal circuit layers, wherein each layer of the multi-layer internal circuit layer includes the metal block 3, and the side of the anti-crack circuit board is provided with a For clamping the hook 4 of the anti-crack circuit board, the anti-crack circuit board includes an upper surface and a lower surface opposite to the upper surface, at least one milling groove 5 matching the hook is formed on the edge...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention discloses an anti-crack circuit board. A first circuit layer is provided with a first signal line as well as a first side edge and a second side edge; the anti-crack circuit board is provided with a second signal line which is arranged to the lower side of the first signal line; the edge of the second signal line is provided with a metal block; the metal block is split structurally; and at least one internal line layer is arranged in the metal block and is located between a first surface and a second surface. The circuit board is a multilayer circuit board provided with a plurality of internal line layers; each of the plurality of internal line layers comprises the metal block; a clamping hook for clamping the circuit board is arranged at the side edge of the circuit board; the circuit board comprises an upper surface and a lower surface opposite to the upper surface; at least one milled countersunk groove matched with the clamping hook is formed at the edge of the upper surface; and the at least one milled countersunk groove accommodates the clamping hook and makes the clamping hook located between the upper surface and lower surface when a carrier locks the circuit board. An operator can fix the anti-crack circuit board of the invention by means of the carrier, and does not need to fix the circuit board by means of adhesive taps, and therefore, production costs can be greatly decreased.
Description
technical field [0001] The invention relates to the technical field of anti-crack circuit board production, in particular to an anti-crack circuit board. Background technique [0002] With the rapid development of mobile phones, MP3 and other electronic products, SMT surface mount technology is becoming more and more mature. At the same time, in order to improve production efficiency, the requirements for equipment automation are also increasing. At present, in the PCB surface mount process, the circuit board is still fixed to the carrier by manually sticking adhesive tape. However, this method of manually pasting the adhesive tape to fix the anti-crack circuit board is labor-intensive, low in efficiency, and the cost of the adhesive tape is high, which cannot better meet the current SMT production needs. Contents of the invention [0003] The purpose of the present invention is to solve the problem that the circuit board is not fixed and provide a crack-proof circuit boa...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0271
Inventor 刘常兴陶继宏王利云吴德斌李涛谢建荣董颖辉张小群姜莉
Owner 铜陵安博电路板有限公司