Unlock instant, AI-driven research and patent intelligence for your innovation.

SMD component correction device

A chip component and component technology, which is applied in the field of chip component correction devices, can solve the problems of mounting orientation, mounting position inconsistency, affecting product quality and product consistency, etc., and achieves the effect of high efficiency and accurate positioning

Active Publication Date: 2018-07-20
永州市福源光学技术有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the component moves directly under the placement head, without artificial visual processing, the placement head picks up and places components randomly distributed in different directions of the trough at a fixed angle and movement, so that the components are finally placed on the circuit board. The mounting orientation and mounting position on the board are not uniform, which affects product quality and product consistency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SMD component correction device
  • SMD component correction device
  • SMD component correction device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the implementation scope of the present invention is not limited thereto.

[0025] Such as Figure 1 to Figure 6 As shown, a patch component correction device described in this embodiment includes a strip-shaped component box b1 equipped with patch components, and a plurality of square component pits b2 are arranged on the component box b1, and the component pits There are correction openings b3 on the four sides of b2, and the correction opening b3 is opened from the outside of the component pit b2 to the bottom of the component pit b2; the material belt is improved, and a correction hole is provided on the material belt, and the correction mechanism provided at the terminal can be Quickly perform non-destructive correction on components, with high efficiency and accurate positioning. The material belt is improved, and a correctio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a chip component correcting apparatus, comprising an elongated strip-shaped component box holding chip components. Multiple square-shaped component pits are arranged on the component box. The component pits are provided on all four sides with correcting openings. The correcting openings are provided from the outside of the component pits to the bottom surfaces of the component pits. An improvement is made on a material belt. Correcting holes are provided on the material belt. A correcting mechanism provided at a terminal is capable of performing lossless correction with respect to the components, is highly efficient, and provides accurate positioning.

Description

technical field [0001] The invention relates to a patch element correcting device. Background technique [0002] At present, in the prior art, the material tape a1, namely the component box, is provided with several material troughs a2, namely the component pits, and a single component a3 is placed in each material trough, and the placement machine usually includes common components such as a placement head and a feeder , the components on the tape are sequentially supplied from the feeder, and the placement head picks up the components from the feeder and then moves to the circuit board for component placement. Such as figure 1 , each component is individually packaged in material tape a1, which is a trough a2 of the component box, that is, the component pit. For the convenience of picking and placing, the component a3 is slightly smaller than the trough, and the components can be irregularly placed in the trough at a level of no more than 2 degrees Rotate or translate to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02
CPCH05K13/022
Inventor 李翰钊
Owner 永州市福源光学技术有限公司