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A kind of sealing protection structure and sealing method of BGA device

A sealing protection and device technology, which is applied in the direction of electrical components, electrical components assembled printed circuits, printed circuits, etc., can solve problems such as device damage, and achieve the effect of ensuring pressure balance

Active Publication Date: 2019-02-22
郑州兴航科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In vacuum, there is a pressure difference at the sealing interface of the BGA device, which will cause serious damage to the device

Method used

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  • A kind of sealing protection structure and sealing method of BGA device
  • A kind of sealing protection structure and sealing method of BGA device

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0033] Such as figure 1 As shown, a sealing structure of a BGA device provided by an embodiment of the present invention includes: a prefabricated sealing sheet 1, a sealant 2, a BGA device 3 and a printed circuit board 5;

[0034] The prefabricated sealing sheet 1 is arranged in the gap between the BGA device 3 and the printed circuit board 5, the bottom surface of the prefabricated sealing sheet 1 is in contact with the top surface of the printed circuit board 5, and the side surface of the prefabricated sealing sheet 1 along the length direction is in contact with the BGA side contacts of device 3;

[0035] The sealant 2 is coated on the prefabricated sealing sheet 1, and is used for sealing and connecting the prefabricated sealing sheet 1 and the BGA device 3 and the printed circuit boar...

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PUM

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Abstract

The invention discloses a sealing protection apparatus for a BGA device, and a sealing method of the sealing protection apparatus, and relates to the technological process of aerospace electronic and electrical product protection processing. The apparatus comprises a prefabricated sealing piece, sealing glue, the BGA device and a printed circuit board. The prefabricated sealing piece is disposed at a gap between the periphery of the BGA device and the printed circuit board, and the bottom surface of the prefabricated sealing piece makes contact with the top surface of the printed circuit board. A side surface of the prefabricated sealing piece in the length direction makes contact with a side surface of the BGA device. The sealing glue wraps the prefabricated sealing piece and is used for the sealing connection of the prefabricated sealing piece, the BGA device and the printed circuit board. The prefabricated sealing piece is provided with a first through hole, and the first through hole is used for balancing the pressure of two sides of a sealing interface. A part, opposite to the first through hole, of the solidified sealing glue is provided with a second through hole in communication with the first through hole.

Description

technical field [0001] The invention relates to the field of protective treatment technology for aerospace electronic and electrical products, in particular to a sealing protection structure of a BGA (Ball Grid Array, solder ball array package) device and a sealing method thereof. Background technique [0002] With the development of science and technology, the integration of circuit boards is getting higher and higher. Ball array devices and special devices on circuit boards are facing the trend of miniaturization. In order to meet this development requirement, some advanced high-density packaging technologies have emerged, and BGA packaging technology is one of them. BGA packaged devices have the characteristics of small size, high integration, and good reliability, and are widely used in various fields of industry and daily life. The BGA device is connected to the circuit board through surface mount soldering. Due to the many solder joints of the device, in the actual u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3436H05K2203/0415
Inventor 沙婷董玉郝葳潇栗凡
Owner 郑州兴航科技有限公司