Computer heat dissipation case with high heat dissipation performance

A computer, high heat dissipation technology, applied in computing, instruments, electrical and digital data processing, etc., can solve the problems of computer running speed, low heat dissipation efficiency, etc., to achieve low production cost, reduced evaporation, and reasonable and simple structure.

Active Publication Date: 2017-09-22
YANTAI SANXIN NEW ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The quality of computer cooling will be directly related to the stability of product operation and the service life of the whole machine; at present, computer cooling is provided with cooling holes on the chassis, through the automatic exchange of

Method used

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  • Computer heat dissipation case with high heat dissipation performance
  • Computer heat dissipation case with high heat dissipation performance
  • Computer heat dissipation case with high heat dissipation performance

Examples

Experimental program
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Effect test

Example Embodiment

[0017] Such as figure 1 As shown, this specific embodiment adopts the following technical solutions: a computer heat dissipation case with high heat dissipation performance, including: a sealed case 1 and an electronic device 2. The sealed case 1 is provided with electronic devices 2 and also includes a heat sink 3 , Heat absorbing shell 4, fixing piece 5, heat absorbing fan 6, protective cover 7, protective cover 2, heat absorbing fan 2, fixing piece 10, cooling water tank 11, filter 12, fan 13, Air deflector 14, air blower 15, filter layer 16, cooling water 17, heat exchange pipe 18, fixed cover 19, water level observation port 20, universal wheel 21, return pipe 22 and cooler 23; heat sink 3 is several The heat-absorbing heads 3 are respectively and evenly fixedly connected to the bottom surface of the heat-absorbing shell 4, and the insides of the heat-absorbing heads 3 are connected to the inside of the heat-absorbing shell 4; the top surface of the heat-absorbing shell 4 i...

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PUM

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Abstract

The invention discloses a computer heat dissipation case with high heat dissipation performance. The computer heat dissipation case comprises a sealed case body, an electronic device, heat absorption heads, a heat absorption shell, a first fixing part, a first heat absorption fan, a first protecting cover, a second protecting cover, a second heat absorption fan, a second fixing part, a cooling water tank, a filtering net, a fan, an air deflector, an air blower, a filtering layer, cooling water, a plurality of heat exchange pipelines, a fixing cover, a water level observation port, universal wheels, a reflux pipeline and a cooler. The computer heat dissipation case has the advantages that the structure is reasonable and simple; during cooling, the first heat absorption fan, the second heat absorption fan and the fan are started first, the first heat absorption fan and the second heat absorption fan can effectively absorb heat inside the sealed case body through the heat absorption heads at the lower side of the heat absorption shell, meanwhile, external air enters the sealed case body uniformly through the heat exchange pipelines after being filtered through the filtering layer to cool the electronic device, and the fan can blow air through the air blower to evaporate the cooling water in the cooling water tank for cooling.

Description

Technical field: [0001] The invention relates to the field of computer hardware equipment, in particular to a computer heat dissipation chassis with high heat dissipation performance. Background technique: [0002] With the rapid development of the economy, the use of computers has been widely popularized, used in all walks of life, and has become a necessary equipment for office. When the computer is running, the components inside the chassis will emit heat. For example, the power supply, CPU, graphics card, etc. in the chassis will generate heat, which will increase the temperature in the chassis, which will affect the running speed of the computer. Hot summer. The quality of computer cooling will be directly related to the stability of product operation and the service life of the whole machine; at present, computer cooling is provided with cooling holes on the chassis, through the automatic exchange of heat inside and outside, to achieve the purpose of cooling, but this...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20G06F2200/201
Inventor 张莲莲
Owner YANTAI SANXIN NEW ENERGY TECH CO LTD
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