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Connection method and assembly

A connection method, a technology of circuit components, applied in the direction of connection, conductive connection, electrical component connection, etc., can solve problems such as production efficiency or yield decline

Active Publication Date: 2017-10-13
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, production efficiency or yield decreases

Method used

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  • Connection method and assembly
  • Connection method and assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106]

[0107] The following formulations were uniformly mixed to prepare a mixture.

[0108] -formula-

[0109] Phenoxy resin (product name: YP50, manufactured by Nippon Steel & Sumikin Chemical Co.): 30 parts by mass;

[0110] Naphthalene type epoxy resin (product name: HP4032D, manufactured by DIC): 35 parts by mass;

[0111] Dicyclopentadiene type epoxy resin (product name: EP4088S, manufactured by ADEKA): 10 parts by mass;

[0112] Elastomer (product name: Teisan Resin SG-80H, manufactured by Nagase Chemtex): 10 parts by mass;

[0113] Curing agent (product name: NOVACURE 3941HP, manufactured by Asahi Kasei eMaterials): 55 parts by mass;

[0114] Conductive particles (product name: Bright, manufactured by Nippon Chemical Industry Co., Ltd., with an average particle diameter of 10 mu m): 3 parts by mass;

[0115] The resulting mixture was coated on silicone-treated PET (polyethylene terephthalate) using a bar coater so that the average thickness after drying was 3...

Embodiment 1～4、 comparative example 1 and 2

[0143]

[0144] Except having changed the recipe in Example 1 to the recipe shown in Table 1, it carried out similarly to Example 1, and obtained the anisotropic conductive film. A conjugate was further obtained.

[0145] The same operation as in Example 1 was performed and evaluated. The results are shown in Table 1.

[0146] [Table 1]

[0147]

[0148] Phenoxy resin: product name: YP-50, manufactured by Nippon Steel & Sumitomo Metal Chemical Co.;

[0149] Epoxy resin No.1: Naphthalene-type epoxy resin, HP4032D, manufactured by DIC Corporation, viscosity: 4,500 mPa·s;

[0150] Epoxy resin No.2: Dicyclopentadiene epoxy resin, EP4088S, manufactured by ADEKA, viscosity: 140mPa·s;

[0151] Epoxy resin No.3: Bisphenol A type epoxy resin, YL980, manufactured by Mitsubishi Chemical Corporation, viscosity: 3,700mPa·s;

[0152] Epoxy resin No.4: Bisphenol F type epoxy resin, YL983U, manufactured by Mitsubishi Chemical Corporation, viscosity: 1,240 mPa·s;

[0153] Elastomer:...

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Abstract

A connection method in which a terminal of a first circuit member and a terminal of a second circuit member are connected so as to enable anisotropic conduction, wherein the connection method comprises: a first disposition step in which an anisotropic conductive film is disposed on the terminal of the first circuit member; a second disposition step in which the second circuit member is disposed on the anisotropic conductive film such that the terminal of the second circuit member contacts the anisotropic conductive film; a temporary fixing step for pressing the second circuit member at the temperature of human skin; and a heating / pressing step for heating and pressing the second circuit member with a heat-pressing member, the anisotropic conductive film containing a liquid epoxy resin having a viscosity of 15-150 mPa*s.

Description

technical field [0001] The present invention relates to attachment methods and adapters. Background technique [0002] Conventionally, as a means of connecting electronic components and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (Anisotropic Conductive Film, ACF)) coated with a thermosetting resin on a release film, the thermosetting resin Conductive particles are dispersed in it. [0003] For example, the case where the anisotropic conductive film is connected to a terminal of a flexible printed circuit board (FPC) or an integrated circuit (Integrated Circuit, IC) chip and an electrode formed on a glass substrate of a liquid crystal display (Liquid Crystal Display, LCD) panel is Typically, it is used when making electrical connections while bonding various terminals to each other. [0004] As mentioned above, when using an anisotropic conductive film to anisotropically conductively connect circuit elements, the following method...

Claims

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Application Information

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IPC IPC(8): H01R11/01H01L21/60
CPCH01R11/01
Inventor 加来尚美山田泰伸
Owner DEXERIALS CORP