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Connection methods and adapters

A connection method and technology of circuit components, applied in the direction of connection, conductive connection, electrical component connection, etc., can solve problems such as production efficiency or yield decline

Active Publication Date: 2019-06-21
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, production efficiency or yield decreases

Method used

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  • Connection methods and adapters
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  • Connection methods and adapters

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106]

[0107] The following formulations were uniformly mixed to prepare a mixture.

[0108] -formula-

[0109] Phenoxy resin (product name: YP50, manufactured by Nippon Steel & Sumikin Chemical Co.): 30 parts by mass;

[0110] Naphthalene type epoxy resin (product name: HP4032D, manufactured by DIC): 35 parts by mass;

[0111] Dicyclopentadiene type epoxy resin (product name: EP4088S, manufactured by ADEKA): 10 parts by mass;

[0112] Elastomer (product name: Teisan Resin SG-80H, manufactured by Nagase Chemtex): 10 parts by mass;

[0113] Curing agent (product name: NOVACURE 3941HP, manufactured by Asahi Kasei eMaterials): 55 parts by mass;

[0114] Conductive particles (product name: Bright, manufactured by Nippon Chemical Industry Co., Ltd., with an average particle diameter of 10 mu m): 3 parts by mass;

[0115] The resulting mixture was coated on silicone-treated PET (polyethylene terephthalate) using a bar coater so that the average thickness after drying was 3...

Embodiment 1~4、 comparative example 1 and 2

[0143]

[0144] Except having changed the recipe in Example 1 to the recipe shown in Table 1, it carried out similarly to Example 1, and obtained the anisotropic conductive film. A conjugate was further obtained.

[0145] The same operation as in Example 1 was performed and evaluated. The results are shown in Table 1.

[0146] [Table 1]

[0147]

[0148] Phenoxy resin: product name: YP-50, manufactured by Nippon Steel & Sumitomo Metal Chemical Co.;

[0149] Epoxy resin No.1: Naphthalene-type epoxy resin, HP4032D, manufactured by DIC Corporation, viscosity: 4,500 mPa·s;

[0150] Epoxy resin No.2: Dicyclopentadiene epoxy resin, EP4088S, manufactured by ADEKA, viscosity: 140mPa·s;

[0151] Epoxy resin No.3: Bisphenol A type epoxy resin, YL980, manufactured by Mitsubishi Chemical Corporation, viscosity: 3,700mPa·s;

[0152] Epoxy resin No.4: Bisphenol F type epoxy resin, YL983U, manufactured by Mitsubishi Chemical Corporation, viscosity: 1,240 mPa·s;

[0153] Elastomer:...

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Abstract

A connection method in which a terminal of a first circuit member and a terminal of a second circuit member are connected so as to enable anisotropic conduction, wherein the connection method comprises: a first disposition step in which an anisotropic conductive film is disposed on the terminal of the first circuit member; a second disposition step in which the second circuit member is disposed on the anisotropic conductive film such that the terminal of the second circuit member contacts the anisotropic conductive film; a temporary fixing step for pressing the second circuit member at the temperature of human skin; and a heating / pressing step for heating and pressing the second circuit member with a heat-pressing member, the anisotropic conductive film containing a liquid epoxy resin having a viscosity of 15-150 mPa·s.

Description

technical field [0001] The present invention relates to attachment methods and adapters. Background technique [0002] Conventionally, as a means of connecting electronic components and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (Anisotropic Conductive Film, ACF)) coated with a thermosetting resin on a release film, the thermosetting resin Conductive particles are dispersed in it. [0003] For example, the case where the anisotropic conductive film is connected to a terminal of a flexible printed circuit board (FPC) or an integrated circuit (Integrated Circuit, IC) chip and an electrode formed on a glass substrate of a liquid crystal display (Liquid Crystal Display, LCD) panel is Typically, it is used when making electrical connections while bonding various terminals to each other. [0004] As mentioned above, when using an anisotropic conductive film to anisotropically conductively connect circuit elements, the following method...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01H01L21/60
CPCH01R11/01
Inventor 加来尚美山田泰伸
Owner DEXERIALS CORP