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Printed circuit board

A technology for printed circuit boards and copper foil substrates, which is used in printed circuits, printed circuits, printed circuit manufacturing, etc., and can solve the problem of insufficient tin consumption of the chips to be soldered, solder paste collapse, and reduction of the chip process yield in the printed circuit board. problem, to achieve the effect of improving the contact yield of solder paste

Inactive Publication Date: 2017-10-20
UNLIMITER MFA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when performing surface fixing technology, if the area of ​​the solder pad is too large, it is easy to cause the solder paste to collapse during the heating process, that is to say, the solder paste is melted and flows in a liquid state, which not only causes the position of the chip to be soldered above the solder paste to be out of position. If it is shifted, it will also happen that the amount of tin to be soldered is insufficient, thereby reducing the process yield of the chip in the printed circuit board, so there is a need for improvement

Method used

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Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the technical content of the present invention, preferred specific embodiments are described as follows. Please refer to the following figure 1 , Figure 2A to Figure 2D A schematic diagram of an embodiment of the printed circuit board of the present invention, and a variation of the concave hole surrounding the solder paste attachment area.

[0024] Such as figure 1 As shown, the printed circuit board 1 of the present invention includes a copper foil substrate 10 and a plurality of concave holes 20, wherein the plurality of concave holes 20 are located on the copper foil substrate 10, so that the copper foil substrate can be mounted on the surface mount technology (Surface Mount Technology) 10 is connected with a chip 90 . In this embodiment, the copper foil substrate 10 is a heat conduction plate of a quad flat no lead package (Quad Flat Noleads, QFN) chip, and the chip 90 is a quad flat no lead packa...

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Abstract

The invention discloses a printed circuit board including a copper foil substrate and a plurality of cavities. The copper foil substrate is used for conducting heat generated during operation of a chip. The copper foil substrate includes a plurality of tin paste sticking zones. The cavities are arranged in the copper foil substrate and are not in mutual connection. The cavities are non-conductors and surround the tin paste sticking zones. Each tin paste sticking zone is surrounded by at least two said cavities. Tin paste contact yield of the printed circuit board can be improved according to the invention.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with a plurality of concave holes on a copper foil substrate to improve the contact yield of solder paste. Background technique [0002] With the vigorous development of electronic devices, and consumers' requirements for high-performance electronic products with thin, light and compact appearance, the heat dissipation requirements of chips inside electronic devices are also increasing. Surface Mount Technology is a process for soldering electronic chips to printed circuit boards. Here we take Quad Flat No leads (QFN) chips as an example. In order to have good heat dissipation efficiency, the thermal pad of this type of chip has a large area. In other words, this type of chip The area where the pad needs to be placed is also large. However, when performing surface fixing technology, if the area of ​​the solder pad is too large, it is easy to cause the solder pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3436H05K2201/09863H05K2201/10727
Inventor 杨国屏杨治勇朱麟和吴文强黄士刚姜义炎
Owner UNLIMITER MFA