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Electrical device and method for manufacturing electrical device

An electrical device and device technology, applied in the field of electrical devices and used in the manufacture of electrical devices

Active Publication Date: 2019-10-25
EPCOS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This often results in having to adapt the product and requiring the manufacture of specialized types of construction

Method used

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  • Electrical device and method for manufacturing electrical device
  • Electrical device and method for manufacturing electrical device
  • Electrical device and method for manufacturing electrical device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] figure 1 The design drawing of the electrical device 1 is shown. The length of the device 1 is variable, as indicated by the broken and dashed view in the middle.

[0055] The device 1 is formed, for example, as a capacitor, especially as a ceramic capacitor. The device 1 is configured as a power capacitor, for example.

[0056] The device 1 has multiple sub-bodies 2. The sub-body 2 is arranged side by side with each other. All daughter bodies 2 preferably have the same size. The number of sub-bodies 2 in the device 1 can be changed according to the desired characteristics of the device 1. The sub-body 2 is configured as a chip, for example.

[0057] The sub-body 2 does not form a monolithic sintered body. The sub-body 2 is arranged spaced apart from each other, for example. For example, there is a gap between adjacent sub-bodies 2. The gap is preferably small due to the miniaturization of the device 1 and the required capacitance density. The sub-body 2 can also be f...

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PUM

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Abstract

An electrical device (1) is proposed, the electrical device has a plurality of daughter bodies (2), a base (3) and at least one connection contact (5), the daughter bodies (2) are arranged on the base, the connection The contact piece is used to electrically connect the daughter body (2) to the carrier (13). Furthermore, a method for producing an electrical component (1) having one or more daughter bodies (2) is proposed.

Description

Technical field [0001] An electrical device is proposed. In particular, it is a ceramic device. The device is configured as a capacitor, for example. In addition, a method for manufacturing an electrical device is proposed. Background technique [0002] In electrical devices as commercial products, different requirements are put forward for size, structure and connection technology according to the installation field. This usually results in the need to adjust the product and requires the manufacture of a special type of construction. [0003] For example, surface-mountable ceramic chips with cover metallization are known, which are described, for example, in document EP 0 929 087 A2. In these devices, lead frames are used to improve mechanical stability. Other capacitors are equipped with solder pins, for example. Of course, the devices are respectively determined in their back end (connection technology). For specialized capacitor types, the back end is usually determined ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G2/06H01G4/232H01G4/38H05K3/34
CPCH01G2/06H01G4/232H01G4/2325H01G4/38H05K3/3426H01G4/228H01G4/248H01G4/30H01R43/26H05K1/181H05K2201/10818H05K2201/10909H05K2201/10015H05K2201/10757Y02P70/50
Inventor 马库斯·科伊尼于尔根·康拉德弗朗茨·林纳马库斯·普夫莫妮卡·斯塔德勒贝尔格奥尔格·屈格尔托马斯·威佩尔
Owner EPCOS AG