Method for measuring position of polyimide thin film and alignment marker

Abstract

The invention provides a method for measuring the position of polyimide thin film and an alignment marker. The method for measuring the position of the polyimide thin film comprises the following steps of providing a substrate, and printing the alignment marker on the substrate, wherein the alignment marker is a symmetrical regular graph, and the center of the alignment marker and the center of the substrate coincide; taking the center of the alignment marker as an original point, marking scales on the alignment marker according to preset spacing; preparing the polyimide thin film on the surface, printed with the alignment marker, of the substrate, measuring the position of the polyimide thin film according to the alignment marker, and judging whether or not offset of the prepared polyimide thin film occurs. Through the adoption of the method for measuring the position of the polyimide thin film and the alignment marker, the offset amount of the polyimide thin film prepared on the substrate can be accurately measured.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a method for measuring the position of a polyimide film and an alignment mark. Background technique [0002] During the manufacturing process of the liquid crystal display panel, it is necessary to prepare a PI (Polyimide Film, polyimide) film on the substrate. To prepare a PI film on a substrate, generally, the PI liquid is evenly applied to the substrate by printing equipment, and then the PI liquid on the surface of the substrate is squeezed, and the PI film is formed after the PI liquid is solidified. The position of the PI film on the substrate There will be deviation relative to the expected position. When the deviation of the PI film is too large and exceeds the specified range, it will affect the subsequent production of the liquid crystal display panel, resulting in the produced liquid crystal display panel not meeting the requirements. Moreover, if the o...

AI Technical Summary

Problems solved by technology

To prepare a PI film on a substrate, generally, the PI liquid is evenly applied to the substrate by printing equipment, and then the PI liquid on the surface of the substrate is squeezed, and the PI film is formed after the PI liquid is solidified. The position of the PI film on the substrate There will be an offset relative to the expected position. When the offset of the PI film is too large and exceeds the specified range, it will affect the subsequent production of the LCD panel, resulting in the produced LCD panel not meeting the requirements.

Moreover, if the offset of the PI film is not known, it is impossible to accurately adjust the printing equipment of the PI film so that the offset of the PI film printed on the substrate is less than the specified error range

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