A single crystal rod cutting device for LED production line
A technology for cutting devices and single crystal ingots, which is applied to fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems affecting the cutting of single crystal ingots, the inability to adjust the cutter, and the inability to clean powder dust in time, to achieve The effect of maintaining cleanliness
Active Publication Date: 2019-02-01
胡序沅
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Problems solved by technology
[0003] In the middle stage of LED chip production, the single crystal rod needs to be cut into flaky wafers for the subsequent growth of epitaxy. The existing wafer cutting device can only cut the wafer into a fixed thickness, and cannot adjust the cutter according to actual needs; the existing The powder dust generated during cutting by advanced wafer cutting devices cannot be cleaned up in time, which will easily affect the subsequent cutting of single crystal rods
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0018] see Figure 1~3 , in an embodiment of the present invention, a single crystal rod cutting device for an LED production line includes a base 1, a top plate 6, a lifting plate 8, a feed roller 9 and a material guide groove 14; two brackets are symmetrically installed on the base 1 2. The first slider 3 is slidably installed on the inner side of the bracket 2. The left and right sides of the lifting plate 8 are fixedly connected with the two first sliders ...
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The invention discloses a single crystal rod cutting device for an LED production line. The single crystal rod cutting device comprises a base, a top plate, a lifting plate, feeding rollers and a guide groove. Two supports are symmetrically installed on the base. First sliding blocks are slidably installed on the inner sides of the supports. The left side and the right side of the lifting plate are fixedly connected with the two first sliding blocks through connecting rods correspondingly. The guide groove is formed in the base. The two feeding rollers are symmetrically arranged at the feeding end of the guide groove. The lifting plate is composed of an installation plate and a sliding rail. A plurality of second sliding blocks are slidably installed on the sliding rail. Cutters are fixedly installed on the lower sides of the second sliding blocks. The single crystal rod cutting device is provided with the installation plate made of a transparent material, the sliding blocks are arranged on the lower side of the installation plate, the positions of the cutters are adjusted by adjusting the positions of the sliding blocks, and single crystal rods can be cut into wafers of different thicknesses according to actual requirements; and an opening is formed in the bottom of the guide groove, powder and dust generated during cutting are sucked through an exhaust fan, and cleanliness of the guide groove is maintained.
Description
technical field [0001] The invention relates to the technical field of LED wafer production, in particular to a single crystal bar cutting device for an LED production line. Background technique [0002] An LED chip is a solid-state semiconductor device that converts electricity directly into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. There are three sizes of high-power LED chips: 38*38mil, 40*40mil, and 45*45mil; in theory, the larger the chip, the greater the current and power it can withstand. [0003] In the middle stage of LED chip production, the single crystal rod needs to be cut into flaky wafers for the subsequent growth of epitaxy. The existing wafer cutting device can only cut the wafer into a fixed thickness, and cannot adjust the cutter according to actual needs; ...
Claims
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IPC IPC(8): B28D5/04B28D7/04
CPCB28D5/0058B28D5/0076B28D5/0082B28D5/04
Inventor 钟云华
Owner 胡序沅