Substrate treatment apparatus

Abstract

A substrate treatment apparatus is provided with: a substrate rotating mechanism that rotates a substrate; a nozzle section that jets droplets of a treatment liquid toward a main surface of the substrate; and a nozzle moving mechanism that moves the nozzle section in the direction along the main surface. The nozzle section is provided with two guide surfaces (511), two gas jetting ports (512), andtwo treatment liquid supply ports (513). Through the gas jetting ports, a gas is jetted along the guide surfaces, and gas flows are formed along the guide surfaces. The treatment liquid supply portsare provided in the guide surfaces, and through each of the treatment liquid supply ports, the treatment liquid is supplied between each of the gas flows and each of the guide surfaces. In the nozzlesection, when one of the two gas jetting ports is considered as a first gas jetting port which forms a gas flow that carries, as a thin film flow, the treatment liquid to a lower end edge (516) of theguide surfaces, the other gas jetting port is considered as a second gas jetting port that forms a gas flow that collides with the treatment liquid scattered from the lower end edge. Consequently, the substrate can be suitably treated by jetting a plurality of droplets having a uniform diameter.

Description

technical field [0001] The present invention relates to a substrate processing device. Background technique [0002] Conventionally, in a manufacturing process of a semiconductor substrate (hereinafter, simply referred to as a "substrate"), a substrate processing apparatus for supplying droplets of a processing liquid onto a substrate surface has been used. For example, a so-called external mixing type two-fluid nozzle is installed in a substrate processing apparatus disclosed in JP 2004-349501 A (Document 1). At one end of the two-fluid nozzle, an annular gas discharge port opens, and the liquid discharge port opens near the center of the gas discharge port. Since the pure water ejected from the liquid ejection port travels almost straight, the nitrogen gas ejected from the annular gas ejection port advances toward the converging point outside the housing in a converging manner, so the nitrogen gas and the pure water collide and mix at the converging point, thereby A jet ...

AI Technical Summary

Problems solved by technology

However, in the cleaning nozzle of Document 2, the number of droplets ejected from a predetermined range per unit time is significantly smaller than that of the two-fluid nozzle.

Therefore, in order to perform the same treatment as the two-fluid nozzle, it is necessary to increase the size of the cleaning nozzle, prolong the cleaning time, etc.

Images