Housing manufacturing method, housing and electronic equipment

A manufacturing method and technology of electronic equipment, which are applied in the directions of electrical components, electrical components, chassis/cabinet/drawer parts, etc., and can solve the problems of easy sticking fingerprints on the outer surface of the shell, etc.

Active Publication Date: 2018-01-30
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after the shell in the prior art is processed, th

Method used

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  • Housing manufacturing method, housing and electronic equipment
  • Housing manufacturing method, housing and electronic equipment
  • Housing manufacturing method, housing and electronic equipment

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Embodiment Construction

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of this application.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of des...

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Abstract

An embodiment of the invention discloses a housing manufacturing method, a housing and electronic equipment. The housing manufacturing method comprises the steps of: providing a substrate, and sequentially carrying out polishing, sandblasting and oxidation treatment on the substrate; spraying a shielding layer on local surface of the outer surface of the substrate after oxidation treatment to forma shielding region and a non-shielding region; carrying out paint spraying treatment on the outer surface of the entire substrate after the shielding layer is sprayed on the local surface of the substrate, so as to form a paint layer containing pearl powder; and removing the shielding layer, so that the outer surface of the substrate presents a sandblasted surface in the shielding region and a pearl highlighted surface in the non-shielding region. The sandblasted surface enables the local region of the outer surface of the housing to have a certain degree of cleanliness and different roughness, the pearl highlighted surface enables the local region of the outer surface of the housing to be pearl highlighted, smooth and flat and not easy to adhere with fingerprints, thus the outer surfaceof the housing can be kept clean and tidy.

Description

Technical field [0001] This application relates to the technical field of electronic equipment, and in particular to a housing manufacturing method, housing and electronic equipment. Background technique [0002] At present, the raw materials for the preparation and processing of the housings of electronic devices, such as mobile phones and tablet computers, are usually aluminum materials, while aluminum materials purchased commercially cannot be directly used due to problems such as their own hardness. The raw aluminum material needs to be processed multiple times to form the required shell structure. However, after the housing in the prior art is processed, fingerprints are easy to stick to the outer surface of the housing. Summary of the invention [0003] The embodiments of the present application provide a method for manufacturing a housing, a housing, and an electronic device, which can reduce fingerprints on the outer surface of the housing. [0004] In a first aspect, an e...

Claims

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Application Information

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IPC IPC(8): H05K5/02H05K13/00
Inventor 杨光明孙文峰袁于才
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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