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Pressing and covering component, fingerprint identification component and electronic equipment

A fingerprint identification and component technology, applied in the structure of telephones, etc., can solve the problems of long production cycle and complicated assembly process of mobile phones, and achieve the effects of shortening the assembly cycle, improving production efficiency, and simplifying the fixed process

Inactive Publication Date: 2018-03-13
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many parts and components of mobile phones, and the assembly process is complicated, which makes the production cycle of mobile phones longer

Method used

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  • Pressing and covering component, fingerprint identification component and electronic equipment
  • Pressing and covering component, fingerprint identification component and electronic equipment
  • Pressing and covering component, fingerprint identification component and electronic equipment

Examples

Experimental program
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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0028] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invent...

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PUM

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Abstract

The invention discloses a pressing and covering component, a fingerprint identification component and electronic equipment. The pressing and covering component comprises a substrate, a circuit board,a base and a cover body, wherein the base is connected with the substrate, the cover body is clamped in the base, a mounting cavity is formed between the cover body and the base, and a part, connectedwith the substrate, of the circuit board is located in the mounting cavity and connected with the substrate. According to the pressing and covering component of the circuit board disclosed by the invention, the circuit board can be fixed on the substrate by using the clamping connection of the base and the cover body, a technical scheme of connecting the circuit board with the substrate by usinga fastener is cancelled, thereby simplifying the fixation procedure of the circuit board; and then the assembling period can be shortened, and the production efficiency is improved.

Description

technical field [0001] The present invention relates to the technical field of communication equipment, in particular, to a cover assembly, a fingerprint recognition assembly and electronic equipment. Background technique [0002] With the development of communication technology, mobile phones have become an indispensable device in people's daily life. There are many types of mobile phones, which are mainly used for communication and have a variety of intelligent functions. The wide application of mobile phones has made mobile phones a modern People's personal items are carried by people almost all the time. There are many parts and components of mobile phones, and the assembly process is complicated, which makes the production cycle of mobile phones longer. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a circuit board gland assembly, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
Inventor 曾元清
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD