Thin film transferring device and using method thereof

Abstract

The invention discloses a thin film transferring device and a using method thereof. The thin film transferring device comprises a box and a vacuum pump; the table top of a first carrying table arranged inside the box and the table top of a second carrying table inside the box are oppositely arranged in the first direction, the table top of the first carrying table is used for bearing a first carrier and an adhesive layer, and the table top of the second carrying table is used for bearing a second carrier and a to-be-transferred thin film; the first carrying table and / or the second carrying table are / is lifted in the first direction; and the vacuum pump is used for providing a vacuum environment for the box. Through a covering and pressing manner, the to-be-transferred thin film is transferred to a to-be-transferred carrier, the vacuum pump is used for providing the vacuum environment for the box, gas in an adhesive is extracted, no air bubbles exist between the transferred thin film and the adhesive, the problem that the device performance is influenced by internal stress of the thin film due to the air bubbles of the adhesive is solved, the product yield is improved; and meanwhile, under the negative pressure environment, the adhesive layer can be in sufficient contact with elements on the two sides, the degree of density is large, the bonding speed is high, and the thin filmtransferring and production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a thin film transfer device and an application method thereof. Background technique [0002] Chemical vapor deposition (Chemical Vapor Deposition, CVD) process refers to the process of introducing the gaseous reactant or liquid reactant vapor containing thin film elements and other gases required for the reaction into the reaction chamber, and chemical reaction occurs on the surface of the substrate to form a thin film. Physical Vapor Deposition (Physical Vapor Deposition, PVD) is to use physical methods under vacuum conditions to vaporize the material source—solid or liquid surface into gaseous atoms, molecules or parts into ions, and pass through low-pressure gas (or plasma) Process, the technology of depositing a thin film with a certain special function on the surface of the substrate. In the manufacturing process of semiconductor devices, usually after the thin film ...

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Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a thin film transfer device and its use method to solve the problem of pressing and transferring the material coated with InSb thin film and the carrier coated with adhesive in the atmosphere in the prior art, resulting in The problem of internal stress between the InSb thin film and the adhesive after transfer

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