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CTP (Computer to Plate) full-laminating disassembling device and disassembling method

A full-fit, micrometer technology, applied in metal processing and other directions, can solve problems such as affecting product life, reduce engineering losses, save costs, and improve product yield.

Inactive Publication Date: 2018-03-30
SHENZHEN SUCCESS ELECTRONICS LTD +3
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Problems solved by technology

[0002] At present, the LCM (LCD display module) and the cover plate basically adopt the full lamination technology, and the lamination foreign matter and air bubbles will be generated during the operation of the full lamination technology. Decomposition and recycling, the traditional repair method is to disassemble by freezing, and freezing at -40 degrees will affect the life of the product

Method used

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  • CTP (Computer to Plate) full-laminating disassembling device and disassembling method

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] A CTP full-fit split device, such as figure 1 shown, including:

[0032] Processing platform 11 and control panel 12, described control panel 12 is positioned at the side of described processing platform 11; Described processing platform 11 top is fixed with vacuum heating platform 1, steel wire 2, micrometer 3, fixed support column 4 and moving rail 10; The inside of the processing platform 11 is provided with a motor;

[0033] The vacuum heating platform 1 is arranged at the top central position of the processing platform 11; the moving rail 10 is located between the vacuum heating platf...

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Abstract

The invention relates to the technical field of full lamination of LCMs (liquid crystal display module) and cover plates, and specifically relates to a CTP (Computer to Plate) full-laminating disassembling device and method. The CTP (Computer to Plate) full-laminating disassembling device comprises a processing platform and a control panel, wherein a vacuum heating platform, a steel wire, micrometers, fixed supporting columns and a moving rail are fixed to the top part of the processing platform; a motor is arranged in the processing platform; a power switch, a vacuum start button, a stop button, a steel wire rotating speed regulator and a temperature controller are arranged on the control panel. The CTP (Computer to Plate) full-laminating disassembling method comprises the following stepsof fixing; adjusting the height; conditioning the temperature; adjusting the rotating speed; pushing the vacuum heating platform to cut; and switching off. According to the device and the method, good LCM and cover plate are recovered through a steel wire cutting method; the problem of influences of intermediate and low temperature on product reliability in a traditional freezing method is solved; the product yield is improved; the engineering loss is reduced; and the product meets the requirement that an industrial product is 5-10 years in service life.

Description

technical field [0001] The invention relates to the technical field of full lamination of LCM and a cover plate, in particular to a CTP full lamination and splitting device and a method for CTP full lamination and splitting. Background technique [0002] At present, the LCM (LCD display module) and the cover plate basically adopt the full lamination technology, and the lamination foreign matter and air bubbles will be generated during the operation of the full lamination technology. Decomposition and recycling, the traditional repair method is to disassemble by freezing, and freezing at -40 degrees will affect the life of the product. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the purpose of the present invention is to optimize the disassembly method of fully laminated products from the traditional freezing method to mechanical steel wire decomposition, so as to avoid the impact of low temperature on product reliability. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/547B26D7/10
CPCB26D1/547B26D7/10
Inventor 张计红卢健丘仙喜赖舒敏
Owner SHENZHEN SUCCESS ELECTRONICS LTD
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