Unlock instant, AI-driven research and patent intelligence for your innovation.

Device including transparent seal and method of making the same

A sealing device, sealing layer technology, applied in the direction of manufacturing tools, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve the problems of high processing temperature, low tensile strength, shear strain, unsuitability, etc.

Active Publication Date: 2021-03-12
CORNING INC
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, glass frits may require higher processing temperatures that are unsuitable for devices such as OLEDs or QDs, and / or may generate undesirable gases after sealing
Frit seals may also have undesirably low tensile strength and / or shear strain
Additionally, using these materials to form a hermetic seal can result in an opaque seal due to the negative CTE inorganic fillers in the frit paste

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device including transparent seal and method of making the same
  • Device including transparent seal and method of making the same
  • Device including transparent seal and method of making the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0067] As noted above, the sealing devices disclosed herein may be used to enclose one or more workpieces. Exemplary, non-limiting artifacts may include color converting elements (e.g., quantum dots (QDs) and phosphors) and / or light emitting structures (e.g., laser diodes (LDs), light emitting diodes (LEDs), and organic light emitting diodes (OLEDs). )Wait. According to some non-limiting embodiments, the sealing device may include one or more cavities containing quantum dots.

[0068] Quantum dots can have varying shapes and / or sizes depending on the desired emission wavelength. For example, as the size of the quantum dot decreases, the frequency of light emission can be increased, for example, the color of the emission can be shifted from red to blue as the size of the quantum dot decreases. When illuminated with blue, UV, or near-UV light, the quantum dots can convert the light to longer wavelengths of red, yellow, green, or blue. According to various embodiments, the qua...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Disclosed herein is a method of making a sealing device (200), the method comprising: placing a sealing layer comprising at least one metal between a first glass substrate (201a) and a second substrate (201b) to form a sealing interface; and directing a laser beam operating at a predetermined wavelength onto the sealing interface, thereby forming at least one seal (207) between the first and second substrates and converting the at least one metal into metal nanoparticles. Also disclosed herein are hermetically sealed devices comprising metal nanoparticles having a particle size of less than about 50 nm, and display devices including such hermetically sealed devices.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 214275, filed Sep. 04, 2015, which application is based upon and is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates generally to sealing devices, and more particularly, to transparent hermetic seals comprising metal nanoparticles, and methods of making such seals using metal films. [0004] technical background [0005] Hermetic glass packages and packaging are becoming increasingly popular for applications in electronic devices and other devices that can benefit from an airtight environment for continuous operation. Exemplary devices that may benefit from hermetic packaging include: televisions, sensors, optical devices, organic light emitting diode (OLED) displays, 3D inkjet printers, laser printers, solid state light emitting sources, and photovoltaic structures...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52C03C27/00H01L23/10C03C27/02
CPCC03C27/08C04B37/045C04B2235/665C04B2237/10C04B2237/12C04B2237/121C04B2237/122C04B2237/123C04B2237/124C04B2237/125C04B2237/34C04B2237/343C04B2237/361C04B2237/365C04B2237/366C04B2237/62C04B2237/708C04B2237/72B32B17/06C09K11/08H10K50/8426H10K2102/331H01L23/10H10K50/841B23K2101/36B23K2103/52B23K2103/54B23K1/0056B32B9/005B32B2457/00B82Y20/00B82Y40/00
Inventor M·J·德内卡I·杜塔S·E·科瓦S·L·洛谷诺夫M·A·恰萨达
Owner CORNING INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com