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Fabrication process and device for extremely-fine hole

A manufacturing process and device manufacturing technology, which is applied in the field of ultra-fine hole manufacturing technology and devices, can solve the problems of low production efficiency, high cost, and poor surface appearance, and achieve the goal of increasing production capacity, reducing costs, and reducing the ratio of poor appearance Effect

Inactive Publication Date: 2018-05-04
苏州鸿鼎合精密电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the opening of 0.25mm round holes on some products is generally produced by etching process, but the opening of the etching process is easy to cause the problem of poor surface appearance, and the production efficiency is very low and the cost is relatively high

Method used

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  • Fabrication process and device for extremely-fine hole

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Embodiment Construction

[0016] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0017] A manufacturing process of extremely fine holes, which includes the following steps:

[0018] S1, set the mold core on the product;

[0019] S2, correspondingly set the insert on the mold core;

[0020] S3. A punch is set above the inlet, and the punch is punched into the mold core through the positioning of the inlet to make the round hole of the product.

[0021] Wherein, the diameter of the punch is 0.25 mm.

[0022] Such as figure 1 As shown, a 0.25mm ultra-fine hole manufacturing device includes a mold core 1 arranged on the product to be holed. The mold core 1 is provided with an inlet 2 for positioning, and the inlet 2 is set There are fine holes, and the punch 3 pun...

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Abstract

The invention discloses a fabrication process for an extremely-fine hole. The fabrication process comprises the following steps that S1, a mold core is arranged on a product; S2, an insert core is correspondingly arranged on the mold core; S3, a punching pin is arranged on the insert core, and the punching pin is made to be punched into the mold core to fabricate a circular hole of the product through positioning of the insert core. On the other hand, the invention discloses a fabrication device for a 0.25 mm extremely-fine hole, the fabrication device comprises the mold core arranged on the product to be punched, the upper portion of the mold core is provided with the insert core used for positioning, the insert core is provided with a fine hole, and the punching pin is punched into the mold core to fabricate the circular hole of the product through the positioning of the insert core. According to the fabrication process and device for the extremely-fine hole, the extremely-fine circular hole is fabricated through a punching method, the undesirable ratio of appearance can be reduced, the production capacity is improved, and the cost is lowered.

Description

Technical field [0001] The invention relates to a manufacturing process and device for extremely fine holes. Background technique [0002] In industrial production, it is often necessary to open round holes in some products. It is more difficult to open millimeter-level round holes. In the prior art, the openings of 0.25mm round holes on some products are generally produced by an etching process, but the opening of the etching process is likely to cause the problem of poor surface appearance, and the production efficiency is very low and the cost is relatively high. Therefore, the development of a 0.25mm ultra-fine hole opening process has become an urgent technical problem to be solved. Summary of the invention [0003] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide a manufacturing process of extremely fine holes. [0004] In order to solve the above technical problems, the present invention provides the follow...

Claims

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Application Information

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IPC IPC(8): B21D28/24B21D28/34
CPCB21D28/24B21D28/34
Inventor 裴来松吴雷龙王刚
Owner 苏州鸿鼎合精密电子有限公司