A Self-healing Triple Modular Redundancy Structure Against Single Event Soft Error Accumulation

Abstract

The invention discloses a three-mode redundant structure with self-recovery and anti-single event soft error accumulation. The circuit is optimized by adding a single event soft error detection circuit and a data selection circuit. The design based on this structure can be used in three-mode redundant In the redundant structure, the single-channel signal recovers automatically after being flipped, which can effectively solve the problem that the triple-mode redundant structure may cause single-event reinforcement failure due to error accumulation.

Description

technical field

[0001] The invention belongs to the technical field of semiconductor integrated circuits, in particular to a triple-mode redundant structure capable of self-recovery and anti-single event soft error accumulation. Background technique

[0002] The single event effect is caused by space particles, especially high-energy particles hitting semiconductor devices, resulting in instantaneous photocurrent. The single event effect will cause the voltage disturbance of the device. When a single event attacks the storage circuit, it will cause the flip of the storage circuit, which is called a single event flip; when the single event hits the combinational logic, it will generate a transient pulse that can propagate along the combinational logic. , that is, a single-event transient, and a single-event soft error will also be caused after the single-event transient is captured by a storage unit such as a flip-flop.

[0003] The commonly used structure to solve the probl...

Examples

Embodiment Construction

[0018] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0019] figure 1 It is a schematic diagram of a three-mode redundant structure for self-healing anti-single event soft error accumulation provided by the emb...

technical field

[0001] The invention belongs to the technical field of semiconductor integrated circuits, in particular to a triple-mode redundant structure capable of self-recovery and anti-single event soft error accumulation. Background technique

[0002] The single event effect is caused by space particles, especially high-energy particles hitting semiconductor devices, resulting in instantaneous photocurrent. The single event effect will cause the voltage disturbance of the device. When a single event attacks the storage circuit, it will cause the flip of the storage circuit, which is called a single event flip; when the single event hits the combinational logic, it will generate a transient pulse that can propagate along the combinational logic. , that is, a single-event transient, and a single-event soft error will also be caused after the single-event transient is captured by a storage unit such as a flip-flop.

[0003] The commonly used structure to solve the probl...

Examples

Embodiment Construction

[0018] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0019] figure 1 It is a schematic diagram of a three-mode redundant structure for self-healing anti-single event soft error accumulation provided by the emb...

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