High-adhesion resin and preparation method and application thereof

A high-adhesion, resin technology, applied in the field of polymer polymerization, can solve the problems of slow curing speed, poor compatibility, environmental and health hazards, and achieve the effect of increasing adhesion and good compatibility

Active Publication Date: 2018-06-08
广州五行材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional adhesion promoters usually contain phosphate or siloxane groups. Phosphate groups have strong acidity, poor compatibility with other resins, and only have good effects on a few substrates such as metals.
Moreover, a large amount of phosphides are used in the process of preparing phosphate esters, which is harmful to the environment and health.
Adhesion promoters containing siloxane groups are more widely used as a substitute for phosphate esters, but the siloxane adhesion promoter effect is weak, has a strong matting effect, slow curing speed, and in Poor stability in acidic, alkaline and aqueous systems, difficult to meet actual needs

Method used

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  • High-adhesion resin and preparation method and application thereof
  • High-adhesion resin and preparation method and application thereof
  • High-adhesion resin and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1 Synthesis of acrylic epoxy resin

[0022] 1. Heat the four-necked flask with condenser to 70℃, fill with nitrogen, add 30g methyl methacrylate, 30g butyl acrylate, 30g isooctyl acrylate, 100g dipropylene glycol monomethyl ether, and glycidyl methacrylate Ester 10g, azobisisobutyronitrile initiator 0.5g, 70°C for 13 hours and discharged to obtain acrylic epoxy resin, denoted as P1.

[0023] 2. Synthesis of high-adhesion resin: Put P1 resin into a four-necked flask with condenser, heat up to 140℃, add 12g of 3,4,5-trihydroxybenzoic acid, react at 140℃ for 6 hours, cool and discharge Get the required high-adhesion resin, and apply it to 10cm 2 After drying, the adhesion force of tinplate, glass and PVC plastic board is 0 grade.

Embodiment 2

[0024] Example 2 Synthesis of acrylic epoxy resin

[0025] 1. Heat the four-necked flask with condenser to 70℃, fill with nitrogen, add 20g methyl acrylate, 30g butyl methacrylate, 30g isodecyl acrylate, 100g dipropylene glycol monomethyl ether, and glycidyl methacrylate. 20 g of ester, 0.7 g of azobisisobutyronitrile initiator, kept at 75° C. for 12 hours, and discharged to obtain acrylic epoxy resin, denoted as P2.

[0026] 2. Put the P2 resin into a four-necked flask with a condenser, heat up to 140℃, add 12g 2,3,4-trihydroxybenzoic acid and 11.9g 2,4,6-trihydroxybenzoic acid, and react at 140℃ After 6 hours, cool and discharge the required high-adhesion resin to obtain the required high-adhesion resin. 2 After drying, the adhesion force of tinplate, glass and PVC plastic board is 0 grade.

Embodiment 3

[0027] Example 3 Synthesis of acrylic epoxy resin

[0028] 1. Heat the four-neck flask with condenser to 70℃, fill with nitrogen, add 20g tert-butyl methacrylate, 30g n-octyl acrylate, 20g isodecyl methacrylate, 100g dipropylene glycol monomethyl ether, 30 g of glycidyl acrylate and 0.5 g of azobisisobutyronitrile initiator were discharged at 70°C for 12 hours to obtain acrylic epoxy resin, denoted as P3.

[0029] 2. Put the P3 resin into a four-necked flask with a condenser, raise the temperature to 140℃, add 23.9g of 2,3,4-trihydroxybenzoic acid, 10.8g of 3,5-dihydroxybenzoic acid, and react at 140℃ for 6 After hours, cool the material to obtain the required high-adhesion resin. 2 After drying, the adhesion force of tinplate, glass and PVC plastic board is 0 grade.

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Abstract

The invention belongs to the technical field of macromolecular polymerizing, and discloses a high-adhesion resin and a preparation method and application thereof. The high-adhesion resin is prepared by condensing resin of which the side chain contains at least more than two epoxy groups and polyphenol structure containing acid; the molar ratio of the polyphenol structure containing acid to the epoxy groups in the resin of which the side chain contains at least more than two epoxy groups is (0.1-1): 1; the polyphenol structure containing acid is ortho polyphenol structure containing acid and / or other polyphenol structure containing acid; the ortho polyphenol structure containing acid is 50-100% by mass of the polyphenol structure containing acid. The resin is extremely high in adhesion relative to a base material which is hardly adhered and is applicable to an adhesion accelerator or a temporary protecting coating of glass, metal, plastic, etc.

Description

Technical field [0001] The invention belongs to the technical field of polymer polymerization, and more specifically, relates to a high-adhesion resin and a preparation method and application thereof. Background technique [0002] Adhesion promoters have a wide range of applications in coatings, inks and other fields, especially for low surface energy surfaces. Conventional adhesion promoters usually contain phosphate or siloxane groups. The phosphate groups have strong acidity, have poor compatibility with other resins, and only have good effects on a few substrates such as metals. . Moreover, a large amount of phosphides are used in the process of preparing phosphate esters, which is harmful to the environment and health. Adhesion promoters containing siloxane groups, as a substitute for phosphate esters, have a wider range of uses, but the siloxane adhesion promotion effect is weak, has a strong matting effect, slow curing speed, and The stability in acidic, alkaline and aq...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C08F8/14C08F220/14C08F220/18C08F220/32C08G59/14
CPCC08F8/14C08G59/1455C08F220/1811C08F220/325C08F220/1804C08F220/14C08F220/1808
Inventor杨德彬唐东明刘泽鹏贾国忠
Owner广州五行材料科技有限公司