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Compound heat dissipation airborne electronic equipment module

A technology for airborne electronic equipment and thermal resistance, which is applied to the structural parts of electrical equipment, electrical components, and modification through conduction and heat transfer.

Inactive Publication Date: 2018-06-29
LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limited size of the equipment, the purely natural heat dissipation method cannot meet the heat dissipation requirements of the module

Method used

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  • Compound heat dissipation airborne electronic equipment module

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Embodiment Construction

[0011] Embodiments of the present invention are described in detail below, and the embodiments are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0012] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

[0013] Such as fig...

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Abstract

The invention provides a compound heat dissipation airborne electronic equipment module, graphene films are adhered to the upper surface and the lower surface of a module cooling plate to strengthen the soaking capability of the cooling plate, wherein the graphene film adhered to the upper surface avoids a heat dissipation boss and a pore structure on the upper surface of the module cooling plate;a heat conduction phase change material is adhered to the contact surface of the module cooling plate and a chassis rail, the thermal resistance of the contact surface is reduced, and the capabilityof conducting heat externally of the module is improved; the heat conduction phase change material turns to a liquid state after the temperature is raised, so that a crack in the contact surface is filled. The provided airborne electronic equipment module adopting a graphene and heat conduction phase change material compounded heat dissipation structure realizes the miniaturization of airborne electronic equipment and meets the requirements on miniaturization and light weight of the airborne electronic equipment.

Description

technical field [0001] The invention belongs to the field of heat dissipation design of electronic equipment, and relates to a composite heat dissipation airborne electronic equipment module. Background technique [0002] The development trend of airborne electronic equipment is smaller and smaller volume, higher calculation rate and higher power. The resulting problem is that the power density of the equipment is gradually increasing, and the heat dissipation problem has gradually become the bottleneck of technological development. Due to the limited size of the device, the purely natural heat dissipation method cannot meet the heat dissipation requirements of the module. Contents of the invention [0003] In order to solve the problems existing in the prior art, the present invention proposes a composite heat dissipation airborne electronic equipment module, which adopts a composite heat dissipation structure of graphene and a thermally conductive phase change material ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20481H05K7/20509
Inventor 王晓国李世桥马琳薛程亮马玲
Owner LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC