Assembling structure of connecting suction nozzle

Abstract

The invention relates to an assembling structure of a connecting suction nozzle, comprising a magnetically conductive fixing seat, a magnetically conductive nozzle base and a nozzle mounted on the nozzle base; the fixing seat is provided with a hollow guiding post, and the guiding post is provided with at least one positioning bump. The positioning portion of the nozzle base is provided with a guiding portion and a positioning groove. The positioning portion accommodates the guide post inside the guiding portion by the positioning groove corresponding to the position of the positioning bump, so as to be a horizontal positioning of the nozzle. The nozzle base is provided with a sealing ring and a magnet, and the suction nozzle base and the suction nozzle are attracted to the fixing seat bythe suction force of the magnet. The adjustment of the tapered channel and the sealing ring of the guiding portion can automatically adjust the vertical offset.

Description

technical field [0001] The invention provides an assembly structure for connecting chip suction nozzles, especially an assembly structure that can automatically adjust the vertical offset and horizontal positioning of the overall structure. Background technique [0002] In the packaging process of semiconductors, it is necessary to pick up and place the chip after cutting and grinding, so there will be a device to complete the process of picking up and placing, and the device will have a fixed seat and contact with the chip for picking up and placing nozzle. [0003] As the thickness of the chip becomes thinner and thinner, the common specifications on the market are about 30-50um, and it may become thinner and thinner. As a result, the operation of picking up and placing may occur because the suction nozzle of the artificial device cannot be flattened, or because of the suction The nozzle cannot apply force evenly, resulting in air generation between the chip and the conta...

AI Technical Summary

Problems solved by technology

[0003] As the thickness of the chip becomes thinner and thinner, the common specifications on the market are about 30-50um, and it may become thinner and thinner. As a result, the operation of picking up and placing may occur because the suction nozzle of the artificial device cannot be flattened, or because of the suction The nozzle cannot apply force evenly, resulting in air generation between the chip and the contact surface or the inability to fully bond with the primer, resulting in damage to the chip, so that the fixed seat and nozzle that were originally sucked and placed can no longer meet the production needs. In addition to requiring plane manufacturing, there are also various differences to solve the problem of thin chip holders and suction nozzles.

[0004] There are common structures used to connect and assemble the suction nozzle, one of which is to have a jaw on the fixed seat, and the suction nozzle is directly embedded in the jaw, but it is precisely because the suction nozzle is embedded above the fixed seat In the jaws, the suction nozzle is not easy to take out after it is installed and embedded, making it difficult to replace. When installing the suction nozzle, it is inevitable that it will touch the suction surface of the suction nozzle, which will cause contamination of the suction nozzle, and it is easy to fail due to negligence. Push the suction nozzle to the bottom so that it is flat and inclined with the surface of the fixed seat. It cannot be guaranteed that the suction nozzle must be flat after installation, which will cause the chip to break. To fix it, it is easy to make the suction nozzle deform due to the pressure of the jaws, causing the chip to be crushed and damaged

[0005] In the existing structure connected and assembled with the suction nozzle, there is another fixed seat with its convex structure at the bottom of the vacuum hole to match the corresponding concave structure of the suction nozzle. Although it is easier to install the suction nozzle than the jaw, but because The nozzle needs to be provided with a corresponding concave structure, which is easy to deform during the production process, and also has the problem of nozzle pollution during installation.

Furthermore, due to the material of the suction nozzle, it is easy to have a large tolerance during its manufacture. Although the corresponding concave-convex structural relationship is preset, it is easy to slide and deform, causing chip damage and damage.

[0006] The assembly structure of the suction nozzle can be fixed by the corresponding tight fit relationship, and the positioning feet can also be extended under the fixing seat to match the positioning holes on the suction nozzle. However, due to the tight fit structure between the positioning feet and the suction nozzle, the It is difficult to install and take out, and the suction nozzle and the fixed seat are positioned with a tight fit, which makes it impossible to adjust the structure, and there is a chance of contacting and contaminating the suction nozzle during installation

[0007] In the existing assembly structure, there is also an improvement for fixing the suction nozzle with the corresponding tight fit relationship, and a magnet is embedded on the fixing seat, and an iron sheet or stainless steel sheet for magnetic attraction is added on the suction nozzle. To replace the tight-fit assembly structure, although it can improve the assembly problem of the tight-fit structure, it also causes other technical problems. The iron sheet or stainless steel sheet between the fixed seat and the suction nozzle cannot be completely tightly combined, and there is a possibility of vacuum leakage. , and the magnetic adsorption structure between the magnet and the iron sheet or stainless steel sheet on the suction nozzle has no corresponding positioning, which will cause the problem of horizontal offset on the suction nozzle assembly

[0008] In addition, the existing assembly structure that fixes the suction nozzle in a tight fit relationship focuses on the flatness of the suction nozzle after assembly. The above-mentioned structural improvement of the flatness between the suction nozzle and the fixed seat cannot solve the problem of vertical offset (tilt), especially when the thickness of the chip becomes thinner and thinner, the impact of this problem will become more and more obvious

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