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Assembled structure for connecting nozzles

A technology of assembling structure and junction, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of horizontal offset of suction nozzle assembly, difficult removal of suction nozzles, large tolerance, etc., to ensure flatness, The effect of avoiding magnetic leakage

Active Publication Date: 2021-10-22
林 彦全
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the thickness of the chip becomes thinner and thinner, the common specifications on the market are about 30-50um, and it may become thinner and thinner. As a result, the operation of picking up and placing may occur because the suction nozzle of the artificial device cannot be flattened, or because of the suction The nozzle cannot apply force evenly, resulting in air generation between the chip and the contact surface or the inability to fully bond with the primer, resulting in damage to the chip, so that the fixed seat and nozzle that were originally sucked and placed can no longer meet the production needs. In addition to requiring plane manufacturing, there are also various differences to solve the problem of thin chip holders and suction nozzles.
[0004] There are common structures used to connect and assemble the suction nozzle, one of which is to have a jaw on the fixed seat, and the suction nozzle is directly embedded in the jaw, but it is precisely because the suction nozzle is embedded above the fixed seat In the jaws, the suction nozzle is not easy to take out after it is installed and embedded, making it difficult to replace. When installing the suction nozzle, it is inevitable that it will touch the suction surface of the suction nozzle, which will cause contamination of the suction nozzle, and it is easy to fail due to negligence. Push the suction nozzle to the bottom so that it is flat and inclined with the surface of the fixed seat. It cannot be guaranteed that the suction nozzle must be flat after installation, which will cause the chip to break. To fix it, it is easy to make the suction nozzle deform due to the pressure of the jaws, causing the chip to be crushed and damaged
[0005] In the existing structure connected and assembled with the suction nozzle, there is another fixed seat with its convex structure at the bottom of the vacuum hole to match the corresponding concave structure of the suction nozzle. Although it is easier to install the suction nozzle than the jaw, but because The nozzle needs to be provided with a corresponding concave structure, which is easy to deform during the production process, and also has the problem of nozzle pollution during installation.
In addition, due to the material of the suction nozzle, it is easy to have a large tolerance during its manufacture. Although the corresponding concave-convex structural relationship is preset, it is easy to slide and deform, causing chip damage and damage.
[0006] The corresponding tight fit relationship is used to fix the assembly structure of the suction nozzle. The positioning feet can also be extended under the fixing seat to match the positioning holes on the suction nozzle. However, due to the tight fit structure between the positioning feet and the suction nozzle, the It is difficult to install and take out, and the suction nozzle and the fixed seat are positioned with a tight fit, which makes it impossible to adjust the structure, and there is a chance of contacting and contaminating the suction nozzle during installation
[0007] In the existing assembly structure, there is also an improvement for fixing the suction nozzle with the corresponding tight fit relationship, and a magnet is embedded on the fixing seat, and an iron sheet or stainless steel sheet for magnetic attraction is added on the suction nozzle. To replace the tight-fit assembly structure, although it can improve the assembly problem of the tight-fit structure, it also causes other technical problems. The iron sheet or stainless steel sheet between the fixed seat and the suction nozzle cannot be completely tightly combined, and there is a possibility of vacuum leakage. , and the magnetic adsorption structure between the magnet and the iron sheet or stainless steel sheet on the suction nozzle has no corresponding positioning, which will cause the problem of horizontal offset on the suction nozzle assembly
[0008] In addition, the existing assembly structure that fixes the suction nozzle in a tight fit relationship focuses on the flatness of the suction nozzle after assembly. The above-mentioned structural improvement of the flatness between the suction nozzle and the fixed seat cannot solve the problem of vertical offset (tilt), especially when the thickness of the chip becomes thinner and thinner, the impact of this problem will become more and more obvious

Method used

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  • Assembled structure for connecting nozzles
  • Assembled structure for connecting nozzles
  • Assembled structure for connecting nozzles

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Embodiment Construction

[0050] see Figure 1 to Figure 3 , is a perspective view and an exploded view of the first embodiment of the present invention. The assembly structure in the assembly structure for connecting suction nozzles of the present invention includes a fixing base 10, a suction nozzle base 20, and a suction nozzle 30 is installed on the suction nozzle base 20 , the suction nozzle 30 sucks a chip 40 with its lower end surface.

[0051] The fixing base 10 has a metal body and an engaging portion 11 is provided on its upper end surface for engaging a vacuum aspirator (not shown), and the engaging portion 11 has a vacuum passage 111, which runs through the engaging portion 11 and below The fixed seat 10.

[0052] Same reference Figure 5A As shown in , the fixing base 10 is provided with two positioning parts 12 , and the positioning parts 12 are respectively arranged at different sides of the fixing base 10 . The positioning part 12 runs through the fixing seat 10 and has a tapered cha...

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PUM

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Abstract

The present invention is an assembly structure for connecting suction nozzles, which includes: a fixed seat, a suction nozzle base and a suction nozzle, the fixed seat is provided with a tapered positioning hole; the suction nozzle base is provided with a positioning column inserted into the tapered positioning hole , and is provided with a seal and a magnet. The upper edge of the seal is joined to the bottom surface of the fixed seat. The fixed seat and the base of the suction nozzle are made of a magnetically conductive metal material to avoid magnetic leakage; the suction nozzle is glued to the The suction nozzle base, the suction nozzle is provided with a plurality of flow holes through the top surface to the bottom surface to communicate with the vacuum channel of the fixed seat; the suction nozzle base and the suction nozzle are adsorbed to the fixed seat by the suction force of the magnet, and are combined into a chip to be collected and placed device, and by virtue of the adjustment function of the tapered positioning hole of the fixed seat and the positioning column and seal of the suction nozzle base, the vertical offset can be automatically adjusted, and the horizontal positioning of the suction nozzle can be done at the same time.

Description

technical field [0001] The invention provides an assembly structure for connecting chip suction nozzles, especially an assembly structure that can automatically adjust the vertical offset and horizontal positioning of the overall structure. Background technique [0002] In the packaging process of semiconductors, it is necessary to pick up and place the chip after cutting and grinding, so there will be a device to complete the process of picking up and placing, and the device will have a fixed seat and contact with the chip for picking up and placing nozzle. [0003] As the thickness of the chip becomes thinner and thinner, the common specifications on the market are about 30-50um, and it may become thinner and thinner. As a result, the operation of picking up and placing may occur because the suction nozzle of the artificial device cannot be flattened, or because of the suction The nozzle cannot apply force evenly, resulting in air generation between the chip and the conta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838H01L21/67017H01L21/67092
Inventor 林彦全
Owner 林 彦全