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Manufacturing method of oversized backboard and backboard

A technology with super-large size and manufacturing method, which is applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., and can solve the problems that super-sized backplanes cannot be processed.

Inactive Publication Date: 2018-07-10
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the above problems, the present invention proposes a method for making a super-large backplane and the backplane. The large-size backplane is decomposed into several small-size backplanes at the risk-free signal, and then connected through connectors and cable lines. It is turned on, which solves the technical problem that the oversized backplane cannot be processed

Method used

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  • Manufacturing method of oversized backboard and backboard
  • Manufacturing method of oversized backboard and backboard

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Embodiment Construction

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

[0017] Based on the above, on the one hand, the embodiments of the present invention provide a method for manufacturing a super-large backplane, with figure 1 It is the super-large size backplane of the present invention, with figure 2 It is the super-large size backboard of the present invention, and the method includes:

[0018] Decompose at least one large-size backplane into N small-size backplanes, and reserve via holes according to the wiring, and after processing into small-size backplanes, pass M small-size backp...

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Abstract

The invention provides a manufacturing method of an oversized backboard and the backboard. At least one large-sized backboard is decomposed into a plurality of small-sized backboards and via holes arereserved according to traces; and the small-sized backboards are processed and then connected by using a connector and a cable through the reserved via holes to form the large-sized backboard. According to the manufacturing method of the oversized backboard and the backboard, the technical problem that the oversized backboard cannot be processed is solved.

Description

technical field [0001] The invention relates to the technical field of circuits, in particular to a method for manufacturing a super-large backplane and the backplane. Background technique [0002] In the prior art, the backplane of the printed circuit board industry is used as a motherboard for connection, and the corresponding card board is plugged into the motherboard through a connector to realize signal conduction. The number of layers of this type of backplane is very high, even up to 60 layers, and the thickness is basically more than 3mm. Industries such as communications often require oversized backplanes for communication base stations. If the size of the backplane is too large, the circuit board factory is limited by the processing capacity of the equipment and cannot process it. The existing technology can only process backplanes with a size smaller than 1100mm*600mm for some high-end board factories, and the processing size of most board factories with average ...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K7/14
CPCH05K1/145H05K7/1451
Inventor 张永甲
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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