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Manufacturing method of oversized single-sided or double-sided circuit board and circuit board

A super-sized, circuit board technology, applied in the production method of super-sized single- and double-sided circuit boards and the field of circuit boards, can solve problems such as the inability to process super-sized single- and double-sided circuit boards

Inactive Publication Date: 2018-07-17
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
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Problems solved by technology

[0003] Based on the above problems, the present invention proposes a method for manufacturing super-large single- and double-sided circuit boards and the circuit board, which connects the smaller single- and double-sided circuit boards through connectors, and solves the problem of over-sized single- and double-sided circuit boards. Technical issues that cannot be processed

Method used

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  • Manufacturing method of oversized single-sided or double-sided circuit board and circuit board
  • Manufacturing method of oversized single-sided or double-sided circuit board and circuit board

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Embodiment Construction

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

[0017] Based on the above, on the one hand, the embodiment of the present invention provides a method for manufacturing super-large single-sided and double-sided circuit boards, with figure 1 It is a schematic diagram of the production process of the present invention, with figure 2 It is the oversized single-sided and double-sided circuit board of the present invention, and the method includes:

[0018] Decompose at least one large-size circuit board into N small-size circuit boards, and reserve via holes according to t...

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Abstract

The invention provides a manufacturing method of an oversized single-sided or double-sided circuit board and the circuit board. A large-size circuit board is decomposed into a few of small-size circuit boards at a position free of a risk signal; via holes are reserved according to traces; and the small-size circuit boards are processed and then connected by using high-density connectors through the reserved via holes to manufacture the large-size circuit board, so that the technical problem that the oversized single-sided or double-sided circuit board cannot be processed is solved.

Description

technical field [0001] The invention relates to the technical field of circuits, in particular to a method for manufacturing a super-large single-sided and double-sided circuit board and the circuit board. Background technique [0002] In the existing technology, super-sized single-sided and double-sided circuit boards are often used. For circuit board factories, limited by the processing capabilities of different process equipment, some high-end board factories can only process sizes smaller than 1100mm *For 600mm circuit boards, the processing size of most board factories with average process capabilities is smaller. Once the size of the circuit board designed by the customer exceeds the upper limit of the processing size of the board factory, it cannot be processed. Contents of the invention [0003] Based on the above problems, the present invention proposes a method for making a super-sized single-sided and double-sided circuit board and the circuit board, which conn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/145H05K3/368
Inventor 张永甲
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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