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a pcb

A pair of blind groove technology, applied in the direction of electrical connection of printed components, printed circuit components, printed circuits, etc., can solve the problem of low wiring density, unable to achieve selective connection between components and signal layers, and unable to meet the height of the bottom of the stepped groove. Density and other issues to achieve the effect of improving wiring density

Active Publication Date: 2020-05-05
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The overall metallized step groove is generally only suitable for overall mounting, and cannot realize the selective connection between the mounted components and the signal layer, and has a single function;
[0005] 2. It cannot meet the high density of the bottom of the stepped groove, the placement of multiple components, and the low wiring density

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 As shown, is a schematic cross-sectional view of the PCB provided by Embodiment 1 of the present invention.

[0032] From figure 1 It can be seen from the figure that the PCB is formed by laminating two core boards 4, and a prepreg 5 is arranged between the core boards. Specifically, one side of the PCB is provided with a first blind slot 1, and the bottom of the first blind slot 1 is provided with a second slot 2, and the second slot 2 is a blind slot or a through slot or a blind hole or a through hole. In this embodiment, the first blind slot 1 runs through one core board, the second slot 2 is a through slot, and runs through another core board, the cross-sectional area of ​​the first blind slot 1 is larger than the cross-sectional area of ​​the second slot 2, thus forming a PCB with two-stage stepped slots. In this embodiment, the groove wall of the first blind groove 1 is metallized, the second groove 2 is a through groove and the groove wall of ...

Embodiment 2

[0039] Such as image 3 , which is a schematic cross-sectional view of the PCB provided by Embodiment 2 of the present invention.

[0040] Specifically, in the second embodiment of the present invention, the schematic diagram of the bottom structure of the PCB groove is the same as that of the first embodiment.

[0041] Such as image 3 It can be seen from the figure that, compared with the first embodiment, the difference in the structure of the second embodiment is that the PCB in the second embodiment is formed by pressing five core boards 4 , that is, the number of layers of the core board 4 of the PCB is not limited in the present invention.

[0042] Specifically, the first blind slot 1 runs through three core plates, and the second slot 2 is a blind slot, which runs through one core plate to form a two-stage stepped slot. In this structure, among the multiple components installed at the bottom of the first blind slot 1, some components can be connected to any signal la...

Embodiment 3

[0045] Such as Figure 4 As shown, it is a schematic diagram of the structure of the bottom of the PCB stepped groove in the third embodiment of the invention, as Figure 5 As shown, it is a schematic cross-sectional view of the PCB provided by Embodiment 3 of the present invention.

[0046] Specifically, compared with Embodiment 2, the difference in the structure of Embodiment 3 is that at the bottom of the first blind groove 1, another second groove 2' and a corresponding second part 32' are provided. structure. Specifically, the second slot 2' runs through the two core boards, and the position at the bottom of the first blind slot 1 is not limited, Figure 4 Among them, the second groove 2' is arranged on one side of the second groove 2, and the second groove 2' is a through groove.

[0047]Specifically, in the third embodiment, among the multiple components installed at the bottom of the first blind slot 1, some components can be connected to any signal layer on the sid...

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Abstract

The invention relates to the technical field of circuit boards and discloses a PCB. A first blind groove is arranged in one side of the PCB; the wall of the first blind groove is metalized; a second groove is formed in the bottom of the first blind groove; the wall of the second groove is metalized; a line pattern is arranged at the bottom of the first blind groove and comprises a first part and asecond part; the first part communicates with a metal layer on the wall of the first blind groove; and the second part communicates with a metal layer on the wall of the second groove. The inventionaims at providing the PCB, so that the space of a ladder groove in the PCB can be fully utilized, selective connection of components and a signal layer can be achieved in the same groove; and high-density diversified components can be mounted at the bottom of each groove, so that multifunctional integrated assembly is achieved, the mounting volume is reduced, further miniaturization of the PCB isfacilitated and the wiring density is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a PCB. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] In order to meet the requirements of further miniaturization and high-density design of PCB, it is usually adopted to design stepped grooves on the PCB and perform metallization operations on them, but the overall metallization of the conventionally designed stepped grooves has the following disadvantages: [0004] 1. The overall metallized step groove is generally only suitable...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11
CPCH05K1/115H05K2201/09509H05K2201/096
Inventor 纪成光王洪府焦其正刘梦茹赵刚俊
Owner DONGGUAN SHENGYI ELECTRONICS