Bendable and easily cleaned photosensitive component and camera module

Abstract

The invention relates to a bendable and easily cleaned photosensitive component and a camera module. In the packaging process, a photosensitive element is first disposed on a first surface of a substrate so that the photosensitive element is electrically connected with the substrate; and then, a packaging body is formed on the first surface of the substrate and wound around the photosensitive element in a package forming manner; the formed packaging body is very strong and can hardly be detached from the substrate; the packaging body comprises an inner wall adjacent to the photosensitive element and an outer wall away from the photosensitive element; the packaging body is provided with an opening and an opening penetrates the inner wall and the outer wall; the overall photosensitive component is cleaned in a centrifugal water washing manner; the cleaning medium after cleaning carries dust and impurities on the photosensitive element and is discharged out of the packaging body through the opening under the action of centrifugal force, so that the cleaning medium can be discharged out of the packaging body effectively; then, an extension portion is bent along a bendable area so as toblock the opening.

Description

technical field [0001] The invention relates to the field of imaging technology, in particular to a bendable and easy-to-clean photosensitive component and a camera module. Background technique [0002] In recent years, camera modules used to acquire images have become more and more widely used in personal electronics, automotive, and medical fields. For example, camera modules have become the standard for portable electronic devices such as smartphones and tablet computers. One of the accessories. A camera module applied to a portable electronic device can not only acquire images, but also help the portable electronic device realize functions such as instant video calls. With the development trend of portable electronic devices becoming thinner and lighter and users' requirements for imaging quality of camera modules are getting higher and higher, more stringent requirements are put forward for the overall size of the camera module and the imaging capability of the camera ...

AI Technical Summary

Problems solved by technology

[0005] However, during the packaging process, dust and debris will inevitably fall onto the photosensitive chip. If not removed in time, the imaging quality of the camera module will be affected after packaging, causing black shadow problems

Traditionally, water washing is usually used to clean the photosensitive chip after the molding process step. However, due to the structure of the molded camera module, the washed water cannot be completely discharged

Therefore, the area where the photosensitive chip is placed not only still has dust and debris, but also introduces new residual washing water, which is prone to cause black shadows and short circuits

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