A kind of multilayer pcb blind slot gasket processing and filling method
A filling method and technology for gaskets, which are used in multilayer circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as difficulty in filling gaskets, and achieve the effects of convenient batch filling operations, high efficiency, and easy operation.
Active Publication Date: 2020-08-14
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for processing and filling multi-layer PCB blind groove gaskets, using "reinforcing ribs" to obtain integral filling gaskets, and using cover films to assist batch filling of blind groove gaskets, which can effectively solve the problems of the prior art Difficulty in gasket filling when processing thin and large number of blind groove structures
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[0032] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] A method for processing and filling a multilayer PCB blind groove gasket according to the present invention will be described in detail below in conjunction with specific embodiments.
[0034] In this embodiment, the multilayer PCB blind groove structure is as follows: figure 1 shown. It includes surface substrate 1 , prepreg 2 , core layer 3 , other prepregs 4 and bottom plate 5 stacked from top to bottom, and blind groove 6 begins on surface substrate 1 and prepreg 2 . The processing and filling method of the multilayer PCB blind groove gasket in this embodiment are described in detail as follows:
[0035] A met...
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Abstract
The invention provides a processing and filling method for blind slot gaskets of a multi-layer PCB and belongs to the technical field of PCB production. The method comprises the following steps: 1) machining through grooves in corresponding positions of a surface substrate and a prepreg of the multi-layer PCB; 2) machining gaskets on a gasket substrate, and reserving reinforcing ribs between the gaskets and the gasket substrate; 3) attaching a cover film to the upper surface of the surface substrate; 4) placing the gasket substrate on the surface substrate, aligning the gaskets with the through holes in the surface substrate and performing filling; 5) removing the reinforcing ribs of the gaskets and redundant gasket material; 6) laminating boards according to designed board lamination sequence, removing the surface cover film after lamination, and taking out the gaskets in the through grooves to form the required blind groove structure. The cover film is used for assisting gasket filling of the blind grooves, and the problems of gasket alignment and filling caused by deformation and warping of a thin surface substrate are solved; the machined blind groove gaskets adopt the reinforcing robs for connection and positioning, batch filling is facilitated, and the method is suitable for machining mass thin blind groove structures.
Description
technical field [0001] The invention belongs to the technical field of multilayer PCB production, in particular to a method for processing and filling multilayer PCB blind slot gaskets. Background technique [0002] The blind slot of a multi-layer PCB refers to a local area on the printed board that is formed by lamination, milling, etc. and has different heights. The main functions of the blind slot are as follows: one is to realize the input and output ports of the internal electrical signals of each layer; the other is to serve as a cavity and carrier for pasting and mounting chips, capacitors, resistors and other components; the third is to serve as a microwave component interconnection Connected channels are cascaded through gold wires, gold belts, etc. [0003] Filling blind slots with gaskets and taking out the gaskets after pressing is one of the blind slot processing methods widely used in the PCB industry at present. It is more suitable for blind slots with a proc...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/46H05K2201/2009
Inventor 林玉敏戴广乾边方胜龚小林卢军
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP